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Stefan Wahren
c168baec00 dt-bindings: brcm,avs-ro-thermal: Fix binding check issues 
Drop the reg property since this only necessary for the parent and
add the missing thermal-sensor-cells property description.

Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Fixes: 37e9cc08e9678 ("dt-bindings: Add Broadcom AVS RO thermal")
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1579200077-17496-1-git-send-email-stefan.wahren@i2se.com
 2020-01-27 11:43:24 +01:00
Florian Fainelli
5fdd4e310b thermal: brcmstb_thermal: Register different ops per process 
Since we do not have interrupts on BCM7216, we cannot have trip point
crossing, the thermal subsystem expects us to provide a NULL set_trips
operation in that case, so make it possible to provide per-process
thermal_zone_of_device_ops

Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-7-f.fainelli@gmail.com
 2020-01-27 11:41:08 +01:00
Florian Fainelli
eaf7a88d4f thermal: brcmstb_thermal: Restructure interrupt registration 
If we are successful grabbing the interrupt resource, then register an
interrupt handler, this makes it easier to support the interrupt as
being optional, which is it for 7216.

Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-6-f.fainelli@gmail.com
 2020-01-27 11:41:08 +01:00
Florian Fainelli
c9a506139b thermal: brcmstb_thermal: Add 16nm process thermal parameters 
Match the 7216 compatible string in order to derive the correct 16nm
process thermal parameters to obtain correct readings.

Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-5-f.fainelli@gmail.com
 2020-01-27 11:41:08 +01:00
Florian Fainelli
ea0ad0ff38 dt-bindings: thermal: Define BCM7216 thermal sensor compatible 
BCM7216 is a 16nm process STB chip, which requires a different
compatible string to differentiate different temperature formulas.

Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-4-f.fainelli@gmail.com
 2020-01-27 11:41:08 +01:00
Florian Fainelli
8bcda3257a thermal: brcmstb_thermal: Prepare to support a different process 
The driver is currently assuming that it is operating with a 28nm
process chip, which has a specific formula to convert temperature to a
code and vice versa. Update the code to support providing two key
values: offset and multiplier to derive the correct formulas.

Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-3-f.fainelli@gmail.com
 2020-01-27 11:41:08 +01:00
Florian Fainelli
e1ff6fc22f thermal: brcmstb_thermal: Do not use DT coefficients 
At the time the brcmstb_thermal driver and its binding were merged, the
DT binding did not make the coefficients properties a mandatory one,
therefore all users of the brcmstb_thermal driver out there have a non
functional implementation with zero coefficients. Even if these
properties were provided, the formula used for computation is incorrect.

The coefficients are entirely process specific (right now, only 28nm is
supported) and not board or SoC specific, it is therefore appropriate to
hard code them in the driver given the compatibility string we are
probed with which has to be updated whenever a new process is
introduced.

We remove the existing coefficients definition since subsequent patches
are going to add support for a new process and will introduce new
coefficients as well.

Fixes: 9e03cf1b2d ("thermal: add brcmstb AVS TMON driver")
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-2-f.fainelli@gmail.com
 2020-01-27 11:41:08 +01:00
Geert Uytterhoeven
263c8c4c76 thermal: rcar_thermal: Use usleep_range() instead of udelay() 
rcar_thermal_update_temp() takes a mutex, so it is always called in a
context that can sleep.  Hence replace the 300 µs busy loop by a call to
usleep_range(), to allow other threads to run.

Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200115125417.5263-1-geert+renesas@glider.be
 2020-01-27 11:41:08 +01:00
Stefan Wahren
1a90e73248 ARM: configs: Build BCM2711 thermal as module 
This builds the BCM2711 thermal driver as module for the Raspberry Pi 4.

Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Tested-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-5-git-send-email-stefan.wahren@i2se.com
 2020-01-27 11:41:08 +01:00
Stefan Wahren
a1d6989bf1 ARM: dts: bcm2711: Enable thermal 
This enables thermal for the BCM2711 (used on Raspberry Pi 4) by adding
the AVS monitor and a subnode for the thermal part.

Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Tested-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-4-git-send-email-stefan.wahren@i2se.com
 2020-01-27 11:41:08 +01:00
Stefan Wahren
59b781352d thermal: Add BCM2711 thermal driver 
This adds the thermal sensor driver for the Broadcom BCM2711 SoC,
which is placed on the Raspberry Pi 4. The driver only provides
SoC temperature reading so far.

Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Tested-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-3-git-send-email-stefan.wahren@i2se.com
 2020-01-27 11:41:08 +01:00
Stefan Wahren
ee31ff373d dt-bindings: Add Broadcom AVS RO thermal 
Since the BCM2711 doesn't have a AVS TMON block, the thermal information
must be retrieved from the AVS ring oscillator block. This block is part
of the AVS monitor which contains a bunch of raw sensors.

Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-2-git-send-email-stefan.wahren@i2se.com
 2020-01-27 11:42:00 +01:00
Yangtao Li
85f0ad2213 thermal: sun8i: Add hwmon support 
Expose sun8i thermal as a HWMON device.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191228171904.24618-1-tiny.windzz@gmail.com
 2020-01-27 11:41:08 +01:00
Yangtao Li
291292cddc thermal: sun8i: Remove unused variable and unneeded macros 
The cp_ft_flag variable is not used after initialization, so delete
it. After that, THS_EFUSE_CP_FT_MASK, THS_EFUSE_CP_FT_BIT and
THS_CALIBRATION_IN_FT are not needed, so delete them.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200112180925.23705-1-tiny.windzz@gmail.com
 2020-01-27 11:41:08 +01:00
Yangtao Li
69d5f3a9c0 thermal: sun8i: Fix using plain integer as NULL pointer in sun8i_ths_resource_init 
sparse returns a warning:

"drivers/thermal/sun8i_thermal.c:341:60: sparse: sparse: Using plain
integer as NULL pointer".

Fix it by replacing the zero integer by a NULL pointer.

Reported-by: kbuild test robot <lkp@intel.com>
Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200112171318.23025-1-tiny.windzz@gmail.com
 2020-01-27 11:41:08 +01:00
Yangtao Li
d8186285f1 thermal: sun8i: Fix r40 ths number 
According to the spec, r40 has 2 thermal sensors.
Sensor0 located in the CPU, another in the GPU.

Fixes: dccc5c3b6f ("thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40")
Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Tested-by: Corentin Labbe <clabbe.montjoie@gmail.com>
Tested-on: sun8i-r40-bananapi-m2-ultra
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200106174639.20862-1-tiny.windzz@gmail.com
 2020-01-27 11:41:08 +01:00
Krzysztof Kozlowski
ca07ee4e3d thermal: exynos: Rename Samsung and Exynos to lowercase 
Fix up inconsistent usage of upper and lowercase letters in "Samsung"
and "Exynos" names.

"SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked
names.  Therefore they should be written with lowercase letters starting
with capital letter.

The lowercase "Exynos" name is promoted by its manufacturer Samsung
Electronics Co., Ltd., in advertisement materials and on website.

Although advertisement materials usually use uppercase "SAMSUNG", the
lowercase version is used in all legal aspects (e.g. on Wikipedia and in
privacy/legal statements on
https://www.samsung.com/semiconductor/privacy-global/).

Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org
 2020-01-27 10:24:32 +01:00
Martin Blumenstingl
07d243a624 thermal: generic-adc: silence info message for IIO_TEMP channels 
Since commit d36e2fa025 ("thermal: generic-adc: make lookup table
optional") "generic-adc-thermal" can be used with an IIO_TEMP channel.
In this case the following message is logged at probe time:
  no lookup table, assuming DAC channel returns milliCelcius

Silence this info message if the channel type is known to be in
milli celsius. Keep this message when the channel type is unknown or not
of type temperature.

Signed-off-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200107232044.889075-3-martin.blumenstingl@googlemail.com
 2020-01-27 10:24:32 +01:00
Martin Blumenstingl
c1fde6e19f thermal: generic-adc: silence "no lookup table" on deferred probe 
A "generic-adc-thermal" without "temperature-lookup-table" is perfectly
valid since commit d36e2fa025 ("thermal: generic-adc: make lookup
table optional"). On deferred probe the message "no lookup table,
assuming DAC channel returns milliCelcius" is still logged.
Prevent this message on deferred probe of the IIO channel by first
looking up the IIO channel.

Signed-off-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200107232044.889075-2-martin.blumenstingl@googlemail.com
 2020-01-27 10:24:32 +01:00
Yangtao Li
0b28594d67 dt-bindings: thermal: Add YAML schema for sun8i-thermal driver bindings 
sun8i-thermal driver supports thermal sensor in wide range of Allwinner
SoCs. Add YAML schema for its bindings.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-3-anarsoul@gmail.com
 2020-01-27 10:24:32 +01:00
Yangtao Li
dccc5c3b6f thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40 
This patch adds the support for allwinner thermal sensor, within
allwinner SoC. It will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Yangtao Li <tiny.windzz@gmail.com>
Signed-off-by: Ondrej Jirman <megous@megous.com>
Signed-off-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Maxime Ripard <mripard@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219172823.1652600-2-anarsoul@gmail.com
 2020-01-27 10:24:32 +01:00
Daniel Lezcano
93802b031b thermal/drivers/of-thermal: Move the of_thermal_free_zone() to the init section 
The function of_thermal_free_zone() is only used the initialization
function which all belonging to the init section.

Move it also to the __init section.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219222154.16100-2-daniel.lezcano@linaro.org
 2020-01-27 10:24:32 +01:00
Daniel Lezcano
8c24b85d2d thermal/drivers/of-thermal: Make of_thermal_destroy_zones static 
The function of_thermal_destroy_zones() is only used internally by the
of_parse_thermal_zones() for rollbacking in case of error.

Make it static and tag it as an __init function.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191219222154.16100-1-daniel.lezcano@linaro.org
 2020-01-27 10:24:32 +01:00
Daniel Lezcano
23affa2e29 thermal/drivers/cpu_cooling: Rename to cpufreq_cooling 
As we introduced the idle injection cooling device called
cpuidle_cooling, let's be consistent and rename the cpu_cooling to
cpufreq_cooling as this one mitigates with OPPs changes.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
 2020-01-27 10:24:32 +01:00
Daniel Lezcano
a4c428e523 thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driver 
The cpu idle cooling device offers a new method to cool down a CPU by
injecting idle cycles at runtime.

It has some similarities with the intel power clamp driver but it is
actually designed to be more generic and relying on the idle injection
powercap framework.

The idle injection duration is fixed while the running duration is
variable. That allows to have control on the device reactivity for the
user experience.

An idle state powering down the CPU or the cluster will allow to drop
the static leakage, thus restoring the heat capacity of the SoC. It
can be set with a trip point between the hot and the critical points,
giving the opportunity to prevent a hard reset of the system when the
cpufreq cooling fails to cool down the CPU.

With more sophisticated boards having a per core sensor, the idle
cooling device allows to cool down a single core without throttling
the compute capacity of several cpus belonging to the same clock line,
so it could be used in collaboration with the cpufreq cooling device.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org
 2020-01-27 10:24:32 +01:00