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Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Browse Source 
Pull thermal updates from Daniel Lezcano:

 - Add the hwmon support on the i.MX SC (Anson Huang)

 - Thermal framework cleanups (self-encapsulation, pointless stubs,
   private structures) (Daniel Lezcano)

 - Use the PM QoS frequency changes for the devfreq cooling device
   (Matthias Kaehlcke)

 - Remove duplicate error messages from platform_get_irq() error
   handling (Markus Elfring)

 - Add support for the bandgap sensors (Keerthy)

 - Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)

 - Add Renesas R-Car maintainer entry (Niklas Söderlund)

 - Fix error checking after calling ti_bandgap_get_sensor_data() for the
   TI SoC thermal (Sudip Mukherjee)

 - Add latency constraint for the idle injection, the DT binding and the
   change the registering function (Daniel Lezcano)

 - Convert the thermal framework binding to the Yaml schema (Amit
   Kucheria)

 - Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
   R. Silva)

 - Thermal framework cleanups (alphabetic order for heads, replace
   module.h by export.h, make file naming consistent) (Amit Kucheria)

 - Merge tsens-common into the tsens driver (Amit Kucheria)

 - Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)

 - Clean up the rcar_thermal_update_temp() function in the rcar thermal
   driver (Niklas Söderlund)

 - Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
   Tang)

 - Export GDDV, OEM vendor variables, and don't require IDSP for the
   int340x thermal driver - trivial conflicts fixed (Matthew Garrett)

* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
  thermal/int340x_thermal: Don't require IDSP to exist
  thermal/int340x_thermal: Export OEM vendor variables
  thermal/int340x_thermal: Export GDDV
  thermal: qoriq: Update the settings for TMUv2
  thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
  thermal: qoriq: Add platform dependencies
  drivers: thermal: tsens: Merge tsens-common.c into tsens.c
  thermal/of: Rename of-thermal.c
  thermal/governors: Prefix all source files with gov_
  thermal/drivers/user_space: Sort headers alphabetically
  thermal/drivers/of-thermal: Sort headers alphabetically
  thermal/drivers/cpufreq_cooling: Replace module.h with export.h
  thermal/drivers/cpufreq_cooling: Sort headers alphabetically
  thermal/drivers/clock_cooling: Include export.h
  thermal/drivers/clock_cooling: Sort headers alphabetically
  thermal/drivers/thermal_hwmon: Include export.h
  thermal/drivers/thermal_hwmon: Sort headers alphabetically
  thermal/drivers/thermal_helpers: Include export.h
  thermal/drivers/thermal_helpers: Sort headers alphabetically
  thermal/core: Replace module.h with export.h
  ...
This commit is contained in:
Linus Torvalds
2020-06-12 14:10:21 -07:00
parent 44ebe016df 8d485da0dd
commit df2fbf5bfa
42 changed files with 2304 additions and 1069 deletions
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Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
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# SPDX-License-Identifier: (GPL-2.0)
# Copyright 2020 Linaro Ltd.
%YAML 1.2
---
$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml#
$schema: http://devicetree.org/meta-schemas/core.yaml#
title: Thermal cooling device binding
maintainers:
- Amit Kucheria <amitk@kernel.org>
description: |
Thermal management is achieved in devicetree by describing the sensor hardware
and the software abstraction of cooling devices and thermal zones required to
take appropriate action to mitigate thermal overload.
The following node types are used to completely describe a thermal management
system in devicetree:
- thermal-sensor: device that measures temperature, has SoC-specific bindings
- cooling-device: device used to dissipate heat either passively or actively
- thermal-zones: a container of the following node types used to describe all
thermal data for the platform
This binding describes the cooling devices.
There are essentially two ways to provide control on power dissipation:
- Passive cooling: by means of regulating device performance. A typical
passive cooling mechanism is a CPU that has dynamic voltage and frequency
scaling (DVFS), and uses lower frequencies as cooling states.
- Active cooling: by means of activating devices in order to remove the
dissipated heat, e.g. regulating fan speeds.
Any cooling device has a range of cooling states (i.e. different levels of
heat dissipation). They also have a way to determine the state of cooling in
which the device is. For example, a fan's cooling states correspond to the
different fan speeds possible. Cooling states are referred to by single
unsigned integers, where larger numbers mean greater heat dissipation. The
precise set of cooling states associated with a device should be defined in
a particular device's binding.
select: true
properties:
"#cooling-cells":
description:
Must be 2, in order to specify minimum and maximum cooling state used in
the cooling-maps reference. The first cell is the minimum cooling state
and the second cell is the maximum cooling state requested.
const: 2
examples:
- |
#include <dt-bindings/interrupt-controller/arm-gic.h>
#include <dt-bindings/thermal/thermal.h>
// Example 1: Cpufreq cooling device on CPU0
cpus {
#address-cells = <2>;
#size-cells = <0>;
CPU0: cpu@0 {
device_type = "cpu";
compatible = "qcom,kryo385";
reg = <0x0 0x0>;
enable-method = "psci";
cpu-idle-states = <&LITTLE_CPU_SLEEP_0
&LITTLE_CPU_SLEEP_1
&CLUSTER_SLEEP_0>;
capacity-dmips-mhz = <607>;
dynamic-power-coefficient = <100>;
qcom,freq-domain = <&cpufreq_hw 0>;
#cooling-cells = <2>;
next-level-cache = <&L2_0>;
L2_0: l2-cache {
compatible = "cache";
next-level-cache = <&L3_0>;
L3_0: l3-cache {
compatible = "cache";
};
};
};
/* ... */
};
/* ... */
thermal-zones {
cpu0-thermal {
polling-delay-passive = <250>;
polling-delay = <1000>;
thermal-sensors = <&tsens0 1>;
trips {
cpu0_alert0: trip-point0 {
temperature = <90000>;
hysteresis = <2000>;
type = "passive";
};
};
cooling-maps {
map0 {
trip = <&cpu0_alert0>;
/* Corresponds to 1000MHz in OPP table */
cooling-device = <&CPU0 5 5>;
};
};
};
/* ... */
};
...
Documentation/devicetree/bindings/thermal/thermal-idle.yaml
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# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
# Copyright 2020 Linaro Ltd.
%YAML 1.2
---
$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml#
$schema: http://devicetree.org/meta-schemas/core.yaml#
title: Thermal idle cooling device binding
maintainers:
- Daniel Lezcano <daniel.lezcano@linaro.org>
description: |
The thermal idle cooling device allows the system to passively
mitigate the temperature on the device by injecting idle cycles,
forcing it to cool down.
This binding describes the thermal idle node.
properties:
$nodename:
const: thermal-idle
description: |
A thermal-idle node describes the idle cooling device properties to
cool down efficiently the attached thermal zone.
'#cooling-cells':
const: 2
description: |
Must be 2, in order to specify minimum and maximum cooling state used in
the cooling-maps reference. The first cell is the minimum cooling state
and the second cell is the maximum cooling state requested.
duration-us:
description: |
The idle duration in microsecond the device should cool down.
exit-latency-us:
description: |
The exit latency constraint in microsecond for the injected
idle state for the device. It is the latency constraint to
apply when selecting an idle state from among all the present
ones.
required:
- '#cooling-cells'
examples:
- |
#include <dt-bindings/thermal/thermal.h>
// Example: Combining idle cooling device on big CPUs with cpufreq cooling device
cpus {
#address-cells = <2>;
#size-cells = <0>;
/* ... */
cpu_b0: cpu@100 {
device_type = "cpu";
compatible = "arm,cortex-a72";
reg = <0x0 0x100>;
enable-method = "psci";
capacity-dmips-mhz = <1024>;
dynamic-power-coefficient = <436>;
#cooling-cells = <2>; /* min followed by max */
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
thermal-idle {
#cooling-cells = <2>;
duration-us = <10000>;
exit-latency-us = <500>;
};
};
cpu_b1: cpu@101 {
device_type = "cpu";
compatible = "arm,cortex-a72";
reg = <0x0 0x101>;
enable-method = "psci";
capacity-dmips-mhz = <1024>;
dynamic-power-coefficient = <436>;
#cooling-cells = <2>; /* min followed by max */
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
thermal-idle {
#cooling-cells = <2>;
duration-us = <10000>;
exit-latency-us = <500>;
};
};
/* ... */
};
/* ... */
thermal_zones {
cpu_thermal: cpu {
polling-delay-passive = <100>;
polling-delay = <1000>;
/* ... */
trips {
cpu_alert0: cpu_alert0 {
temperature = <65000>;
hysteresis = <2000>;
type = "passive";
};
cpu_alert1: cpu_alert1 {
temperature = <70000>;
hysteresis = <2000>;
type = "passive";
};
cpu_alert2: cpu_alert2 {
temperature = <75000>;
hysteresis = <2000>;
type = "passive";
};
cpu_crit: cpu_crit {
temperature = <95000>;
hysteresis = <2000>;
type = "critical";
};
};
cooling-maps {
map0 {
trip = <&cpu_alert1>;
cooling-device = <&{/cpus/cpu@100/thermal-idle} 0 15 >,
<&{/cpus/cpu@101/thermal-idle} 0 15>;
};
map1 {
trip = <&cpu_alert2>;
cooling-device =
<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
};
};
};
};
Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
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# SPDX-License-Identifier: (GPL-2.0)
# Copyright 2020 Linaro Ltd.
%YAML 1.2
---
$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml#
$schema: http://devicetree.org/meta-schemas/core.yaml#
title: Thermal sensor binding
maintainers:
- Amit Kucheria <amitk@kernel.org>
description: |
Thermal management is achieved in devicetree by describing the sensor hardware
and the software abstraction of thermal zones required to take appropriate
action to mitigate thermal overloads.
The following node types are used to completely describe a thermal management
system in devicetree:
- thermal-sensor: device that measures temperature, has SoC-specific bindings
- cooling-device: device used to dissipate heat either passively or actively
- thermal-zones: a container of the following node types used to describe all
thermal data for the platform
This binding describes the thermal-sensor.
Thermal sensor devices provide temperature sensing capabilities on thermal
zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor
devices may control one or more internal sensors.
properties:
"#thermal-sensor-cells":
description:
Used to uniquely identify a thermal sensor instance within an IC. Will be
0 on sensor nodes with only a single sensor and at least 1 on nodes
containing several internal sensors.
enum: [0, 1]
examples:
- |
#include <dt-bindings/interrupt-controller/arm-gic.h>
// Example 1: SDM845 TSENS
soc: soc@0 {
#address-cells = <2>;
#size-cells = <2>;
/* ... */
tsens0: thermal-sensor@c263000 {
compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
reg = <0 0x0c263000 0 0x1ff>, /* TM */
<0 0x0c222000 0 0x1ff>; /* SROT */
#qcom,sensors = <13>;
interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
<GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
interrupt-names = "uplow", "critical";
#thermal-sensor-cells = <1>;
};
tsens1: thermal-sensor@c265000 {
compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
reg = <0 0x0c265000 0 0x1ff>, /* TM */
<0 0x0c223000 0 0x1ff>; /* SROT */
#qcom,sensors = <8>;
interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
<GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
interrupt-names = "uplow", "critical";
#thermal-sensor-cells = <1>;
};
};
...
Documentation/devicetree/bindings/thermal/thermal-zones.yaml
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# SPDX-License-Identifier: (GPL-2.0)
# Copyright 2020 Linaro Ltd.
%YAML 1.2
---
$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml#
$schema: http://devicetree.org/meta-schemas/base.yaml#
title: Thermal zone binding
maintainers:
- Amit Kucheria <amitk@kernel.org>
description: |
Thermal management is achieved in devicetree by describing the sensor hardware
and the software abstraction of cooling devices and thermal zones required to
take appropriate action to mitigate thermal overloads.
The following node types are used to completely describe a thermal management
system in devicetree:
- thermal-sensor: device that measures temperature, has SoC-specific bindings
- cooling-device: device used to dissipate heat either passively or actively
- thermal-zones: a container of the following node types used to describe all
thermal data for the platform
This binding describes the thermal-zones.
The polling-delay properties of a thermal-zone are bound to the maximum dT/dt
(temperature derivative over time) in two situations for a thermal zone:
1. when passive cooling is activated (polling-delay-passive)
2. when the zone just needs to be monitored (polling-delay) or when
active cooling is activated.
The maximum dT/dt is highly bound to hardware power consumption and
dissipation capability. The delays should be chosen to account for said
max dT/dt, such that a device does not cross several trip boundaries
unexpectedly between polls. Choosing the right polling delays shall avoid
having the device in temperature ranges that may damage the silicon structures
and reduce silicon lifetime.
properties:
$nodename:
const: thermal-zones
description:
A /thermal-zones node is required in order to use the thermal framework to
manage input from the various thermal zones in the system in order to
mitigate thermal overload conditions. It does not represent a real device
in the system, but acts as a container to link a thermal sensor device,
platform-data regarding temperature thresholds and the mitigation actions
to take when the temperature crosses those thresholds.
patternProperties:
"^[a-zA-Z][a-zA-Z0-9\\-]{1,12}-thermal$":
type: object
description:
Each thermal zone node contains information about how frequently it
must be checked, the sensor responsible for reporting temperature for
this zone, one sub-node containing the various trip points for this
zone and one sub-node containing all the zone cooling-maps.
properties:
polling-delay:
$ref: /schemas/types.yaml#/definitions/uint32
description:
The maximum number of milliseconds to wait between polls when
checking this thermal zone. Setting this to 0 disables the polling
timers setup by the thermal framework and assumes that the thermal
sensors in this zone support interrupts.
polling-delay-passive:
$ref: /schemas/types.yaml#/definitions/uint32
description:
The maximum number of milliseconds to wait between polls when
checking this thermal zone while doing passive cooling. Setting
this to 0 disables the polling timers setup by the thermal
framework and assumes that the thermal sensors in this zone
support interrupts.
thermal-sensors:
$ref: /schemas/types.yaml#/definitions/phandle-array
maxItems: 1
description:
The thermal sensor phandle and sensor specifier used to monitor this
thermal zone.
coefficients:
$ref: /schemas/types.yaml#/definitions/uint32-array
description:
An array of integers containing the coefficients of a linear equation
that binds all the sensors listed in this thermal zone.
The linear equation used is as follows,
z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn
where c0, c1, .., cn are the coefficients.
Coefficients default to 1 in case this property is not specified. The
coefficients are ordered and are matched with sensors by means of the
sensor ID. Additional coefficients are interpreted as constant offset.
sustainable-power:
$ref: /schemas/types.yaml#/definitions/uint32
description:
An estimate of the sustainable power (in mW) that this thermal zone
can dissipate at the desired control temperature. For reference, the
sustainable power of a 4-inch phone is typically 2000mW, while on a
10-inch tablet is around 4500mW.
trips:
type: object
description:
This node describes a set of points in the temperature domain at
which the thermal framework needs to take action. The actions to
be taken are defined in another node called cooling-maps.
patternProperties:
"^[a-zA-Z][a-zA-Z0-9\\-_]{0,63}$":
type: object
properties:
temperature:
$ref: /schemas/types.yaml#/definitions/int32
minimum: -273000
maximum: 200000
description:
An integer expressing the trip temperature in millicelsius.
hysteresis:
$ref: /schemas/types.yaml#/definitions/uint32
description:
An unsigned integer expressing the hysteresis delta with
respect to the trip temperature property above, also in
millicelsius. Any cooling action initiated by the framework is
maintained until the temperature falls below
(trip temperature - hysteresis). This potentially prevents a
situation where the trip gets constantly triggered soon after
cooling action is removed.
type:
$ref: /schemas/types.yaml#/definitions/string
enum:
- active # enable active cooling e.g. fans
- passive # enable passive cooling e.g. throttling cpu
- hot # send notification to driver
- critical # send notification to driver, trigger shutdown
description: |
There are four valid trip types: active, passive, hot,
critical.
The critical trip type is used to set the maximum
temperature threshold above which the HW becomes
unstable and underlying firmware might even trigger a
reboot. Hitting the critical threshold triggers a system
shutdown.
The hot trip type can be used to send a notification to
the thermal driver (if a .notify callback is registered).
The action to be taken is left to the driver.
The passive trip type can be used to slow down HW e.g. run
the CPU, GPU, bus at a lower frequency.
The active trip type can be used to control other HW to
help in cooling e.g. fans can be sped up or slowed down
required:
- temperature
- hysteresis
- type
additionalProperties: false
additionalProperties: false
cooling-maps:
type: object
description:
This node describes the action to be taken when a thermal zone
crosses one of the temperature thresholds described in the trips
node. The action takes the form of a mapping relation between a
trip and the target cooling device state.
patternProperties:
"^map[-a-zA-Z0-9]*$":
type: object
properties:
trip:
$ref: /schemas/types.yaml#/definitions/phandle
description:
A phandle of a trip point node within this thermal zone.
cooling-device:
$ref: /schemas/types.yaml#/definitions/phandle-array
description:
A list of cooling device phandles along with the minimum
and maximum cooling state specifiers for each cooling
device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
cooling-device phandle limit specifier lets the framework
use the minimum and maximum cooling state for that cooling
device automatically.
contribution:
$ref: /schemas/types.yaml#/definitions/uint32
minimum: 0
maximum: 100
description:
The percentage contribution of the cooling devices at the
specific trip temperature referenced in this map
to this thermal zone
required:
- trip
- cooling-device
additionalProperties: false
required:
- polling-delay
- polling-delay-passive
- thermal-sensors
- trips
additionalProperties: false
examples:
- |
#include <dt-bindings/interrupt-controller/arm-gic.h>
#include <dt-bindings/thermal/thermal.h>
// Example 1: SDM845 TSENS
soc: soc@0 {
#address-cells = <2>;
#size-cells = <2>;
/* ... */
tsens0: thermal-sensor@c263000 {
compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
reg = <0 0x0c263000 0 0x1ff>, /* TM */
<0 0x0c222000 0 0x1ff>; /* SROT */
#qcom,sensors = <13>;
interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
<GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
interrupt-names = "uplow", "critical";
#thermal-sensor-cells = <1>;
};
tsens1: thermal-sensor@c265000 {
compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
reg = <0 0x0c265000 0 0x1ff>, /* TM */
<0 0x0c223000 0 0x1ff>; /* SROT */
#qcom,sensors = <8>;
interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
<GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
interrupt-names = "uplow", "critical";
#thermal-sensor-cells = <1>;
};
};
/* ... */
thermal-zones {
cpu0-thermal {
polling-delay-passive = <250>;
polling-delay = <1000>;
thermal-sensors = <&tsens0 1>;
trips {
cpu0_alert0: trip-point0 {
temperature = <90000>;
hysteresis = <2000>;
type = "passive";
};
cpu0_alert1: trip-point1 {
temperature = <95000>;
hysteresis = <2000>;
type = "passive";
};
cpu0_crit: cpu_crit {
temperature = <110000>;
hysteresis = <1000>;
type = "critical";
};
};
cooling-maps {
map0 {
trip = <&cpu0_alert0>;
/* Corresponds to 1400MHz in OPP table */
cooling-device = <&CPU0 3 3>, <&CPU1 3 3>,
<&CPU2 3 3>, <&CPU3 3 3>;
};
map1 {
trip = <&cpu0_alert1>;
/* Corresponds to 1000MHz in OPP table */
cooling-device = <&CPU0 5 5>, <&CPU1 5 5>,
<&CPU2 5 5>, <&CPU3 5 5>;
};
};
};
/* ... */
cluster0-thermal {
polling-delay-passive = <250>;
polling-delay = <1000>;
thermal-sensors = <&tsens0 5>;
trips {
cluster0_alert0: trip-point0 {
temperature = <90000>;
hysteresis = <2000>;
type = "hot";
};
cluster0_crit: cluster0_crit {
temperature = <110000>;
hysteresis = <2000>;
type = "critical";
};
};
};
/* ... */
gpu-top-thermal {
polling-delay-passive = <250>;
polling-delay = <1000>;
thermal-sensors = <&tsens0 11>;
trips {
gpu1_alert0: trip-point0 {
temperature = <90000>;
hysteresis = <2000>;
type = "hot";
};
};
};
};
...
Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml
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@@ -0,0 +1,56 @@
# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
%YAML 1.2
---
$id: http://devicetree.org/schemas/thermal/ti,am654-thermal.yaml#
$schema: http://devicetree.org/meta-schemas/core.yaml#
title: Texas Instruments AM654 VTM (DTS) binding
maintainers:
- Keerthy <j-keerthy@ti.com>
properties:
compatible:
const: ti,am654-vtm
reg:
maxItems: 1
power-domains:
maxItems: 1
"#thermal-sensor-cells":
const: 1
required:
- compatible
- reg
- power-domains
- "#thermal-sensor-cells"
additionalProperties: false
examples:
- |
#include <dt-bindings/soc/ti,sci_pm_domain.h>
vtm: thermal@42050000 {
compatible = "ti,am654-vtm";
reg = <0x0 0x42050000 0x0 0x25c>;
power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>;
#thermal-sensor-cells = <1>;
};
mpu0_thermal: mpu0_thermal {
polling-delay-passive = <250>; /* milliseconds */
polling-delay = <500>; /* milliseconds */
thermal-sensors = <&vtm0 0>;
trips {
mpu0_crit: mpu0_crit {
temperature = <125000>; /* milliCelsius */
hysteresis = <2000>; /* milliCelsius */
type = "critical";
};
};
};
...
MAINTAINERS
+9
View File
@@ -14556,6 +14556,15 @@ F: Documentation/devicetree/bindings/i2c/renesas,iic.txt
F: drivers/i2c/busses/i2c-rcar.c
F: drivers/i2c/busses/i2c-sh_mobile.c
RENESAS R-CAR THERMAL DRIVERS
M: Niklas Söderlund <niklas.soderlund@ragnatech.se>
L: linux-renesas-soc@vger.kernel.org
S: Supported
F: Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.txt
F: Documentation/devicetree/bindings/thermal/rcar-thermal.txt
F: drivers/thermal/rcar_gen3_thermal.c
F: drivers/thermal/rcar_thermal.c
RENESAS RIIC DRIVER
M: Chris Brandt <chris.brandt@renesas.com>
S: Supported
drivers/cpuidle/cpuidle-arm.c
+3
View File
@@ -8,6 +8,7 @@
#define pr_fmt(fmt) "CPUidle arm: " fmt
#include <linux/cpu_cooling.h>
#include <linux/cpuidle.h>
#include <linux/cpumask.h>
#include <linux/cpu_pm.h>
@@ -124,6 +125,8 @@ static int __init arm_idle_init_cpu(int cpu)
if (ret)
goto out_kfree_drv;
cpuidle_cooling_register(drv);
return 0;
out_kfree_drv:
drivers/cpuidle/cpuidle-psci.c
+3
View File
@@ -9,6 +9,7 @@
#define pr_fmt(fmt) "CPUidle PSCI: " fmt
#include <linux/cpuhotplug.h>
#include <linux/cpu_cooling.h>
#include <linux/cpuidle.h>
#include <linux/cpumask.h>
#include <linux/cpu_pm.h>
@@ -319,6 +320,8 @@ static int __init psci_idle_init_cpu(int cpu)
if (ret)
goto out_kfree_drv;
cpuidle_cooling_register(drv);
return 0;
out_kfree_drv:
drivers/powercap/idle_inject.c
+15 -1
View File
@@ -61,12 +61,14 @@ struct idle_inject_thread {
* @timer: idle injection period timer
* @idle_duration_us: duration of CPU idle time to inject
* @run_duration_us: duration of CPU run time to allow
* @latency_us: max allowed latency
* @cpumask: mask of CPUs affected by idle injection
*/
struct idle_inject_device {
struct hrtimer timer;
unsigned int idle_duration_us;
unsigned int run_duration_us;
unsigned int latency_us;
unsigned long cpumask[];
};
@@ -138,7 +140,8 @@ static void idle_inject_fn(unsigned int cpu)
*/
iit->should_run = 0;
play_idle(READ_ONCE(ii_dev->idle_duration_us));
play_idle_precise(READ_ONCE(ii_dev->idle_duration_us) * NSEC_PER_USEC,
READ_ONCE(ii_dev->latency_us) * NSEC_PER_USEC);
}
/**
@@ -169,6 +172,16 @@ void idle_inject_get_duration(struct idle_inject_device *ii_dev,
*idle_duration_us = READ_ONCE(ii_dev->idle_duration_us);
}
/**
* idle_inject_set_latency - set the maximum latency allowed
* @latency_us: set the latency requirement for the idle state
*/
void idle_inject_set_latency(struct idle_inject_device *ii_dev,
unsigned int latency_us)
{
WRITE_ONCE(ii_dev->latency_us, latency_us);
}
/**
* idle_inject_start - start idle injections
* @ii_dev: idle injection control device structure
@@ -297,6 +310,7 @@ struct idle_inject_device *idle_inject_register(struct cpumask *cpumask)
cpumask_copy(to_cpumask(ii_dev->cpumask), cpumask);
hrtimer_init(&ii_dev->timer, CLOCK_MONOTONIC, HRTIMER_MODE_REL);
ii_dev->timer.function = idle_inject_timer_fn;
ii_dev->latency_us = UINT_MAX;
for_each_cpu(cpu, to_cpumask(ii_dev->cpumask)) {
drivers/thermal/Kconfig
+12 -2
View File
@@ -273,6 +273,16 @@ config IMX8MM_THERMAL
cpufreq is used as the cooling device to throttle CPUs when the passive
trip is crossed.
config K3_THERMAL
tristate "Texas Instruments K3 thermal support"
depends on ARCH_K3 || COMPILE_TEST
help
If you say yes here you get thermal support for the Texas Instruments
K3 SoC family. The current chip supported is:
- AM654
This includes temperature reading functionality.
config MAX77620_THERMAL
tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
depends on MFD_MAX77620
@@ -285,8 +295,8 @@ config MAX77620_THERMAL
config QORIQ_THERMAL
tristate "QorIQ Thermal Monitoring Unit"
depends on THERMAL_OF
depends on HAS_IOMEM
depends on THERMAL_OF && HAS_IOMEM
depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
select REGMAP_MMIO
help
Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
drivers/thermal/Makefile
+6 -5
View File
@@ -9,14 +9,14 @@ thermal_sys-y += thermal_core.o thermal_sysfs.o \
# interface to/from other layers providing sensors
thermal_sys-$(CONFIG_THERMAL_HWMON) += thermal_hwmon.o
thermal_sys-$(CONFIG_THERMAL_OF) += of-thermal.o
thermal_sys-$(CONFIG_THERMAL_OF) += thermal_of.o
# governors
thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += fair_share.o
thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += gov_fair_share.o
thermal_sys-$(CONFIG_THERMAL_GOV_BANG_BANG) += gov_bang_bang.o
thermal_sys-$(CONFIG_THERMAL_GOV_STEP_WISE) += step_wise.o
thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o
thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR) += power_allocator.o
thermal_sys-$(CONFIG_THERMAL_GOV_STEP_WISE) += gov_step_wise.o
thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += gov_user_space.o
thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR) += gov_power_allocator.o
# cpufreq cooling
thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpufreq_cooling.o
@@ -28,6 +28,7 @@ thermal_sys-$(CONFIG_CLOCK_THERMAL) += clock_cooling.o
# devfreq cooling
thermal_sys-$(CONFIG_DEVFREQ_THERMAL) += devfreq_cooling.o
obj-$(CONFIG_K3_THERMAL) += k3_bandgap.o
# platform thermal drivers
obj-y += broadcom/
obj-$(CONFIG_THERMAL_MMIO) += thermal_mmio.o
drivers/thermal/clock_cooling.c
+2 -1
View File
@@ -12,15 +12,16 @@
* Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org>
*/
#include <linux/clk.h>
#include <linux/clock_cooling.h>
#include <linux/cpufreq.h>
#include <linux/device.h>
#include <linux/err.h>
#include <linux/export.h>
#include <linux/idr.h>
#include <linux/mutex.h>
#include <linux/pm_opp.h>
#include <linux/slab.h>
#include <linux/thermal.h>
#include <linux/clock_cooling.h>
/**
* struct clock_cooling_device - data for cooling device with clock
drivers/thermal/cpufreq_cooling.c
+5 -5
View File
@@ -10,17 +10,17 @@
* Viresh Kumar <viresh.kumar@linaro.org>
*
*/
#include <linux/module.h>
#include <linux/thermal.h>
#include <linux/cpu.h>
#include <linux/cpufreq.h>
#include <linux/cpu_cooling.h>
#include <linux/energy_model.h>
#include <linux/err.h>
#include <linux/export.h>
#include <linux/idr.h>
#include <linux/pm_opp.h>
#include <linux/pm_qos.h>
#include <linux/slab.h>
#include <linux/cpu.h>
#include <linux/cpu_cooling.h>
#include <linux/energy_model.h>
#include <linux/thermal.h>
#include <trace/events/thermal.h>
drivers/thermal/cpuidle_cooling.c
+51 -12
View File
@@ -5,11 +5,14 @@
* Author: Daniel Lezcano <daniel.lezcano@linaro.org>
*
*/
#define pr_fmt(fmt) "cpuidle cooling: " fmt
#include <linux/cpu_cooling.h>
#include <linux/cpuidle.h>
#include <linux/err.h>
#include <linux/idle_inject.h>
#include <linux/idr.h>
#include <linux/of_device.h>
#include <linux/slab.h>
#include <linux/thermal.h>
@@ -154,22 +157,25 @@ static struct thermal_cooling_device_ops cpuidle_cooling_ops = {
};
/**
* cpuidle_of_cooling_register - Idle cooling device initialization function
* __cpuidle_cooling_register: register the cooling device
* @drv: a cpuidle driver structure pointer
* @np: a node pointer to a device tree cooling device node
* @np: a device node structure pointer used for the thermal binding
*
* This function is in charge of creating a cooling device per cpuidle
* driver and register it to thermal framework.
* This function is in charge of allocating the cpuidle cooling device
* structure, the idle injection, initialize them and register the
* cooling device to the thermal framework.
*
* Return: zero on success, or negative value corresponding to the
* error detected in the underlying subsystems.
* Return: zero on success, a negative value returned by one of the
* underlying subsystem in case of error
*/
int cpuidle_of_cooling_register(struct device_node *np,
struct cpuidle_driver *drv)
static int __cpuidle_cooling_register(struct device_node *np,
struct cpuidle_driver *drv)
{
struct idle_inject_device *ii_dev;
struct cpuidle_cooling_device *idle_cdev;
struct thermal_cooling_device *cdev;
unsigned int idle_duration_us = TICK_USEC;
unsigned int latency_us = UINT_MAX;
char dev_name[THERMAL_NAME_LENGTH];
int id, ret;
@@ -191,7 +197,11 @@ int cpuidle_of_cooling_register(struct device_node *np,
goto out_id;
}
idle_inject_set_duration(ii_dev, TICK_USEC, TICK_USEC);
of_property_read_u32(np, "duration-us", &idle_duration_us);
of_property_read_u32(np, "exit-latency-us", &latency_us);
idle_inject_set_duration(ii_dev, TICK_USEC, idle_duration_us);
idle_inject_set_latency(ii_dev, latency_us);
idle_cdev->ii_dev = ii_dev;
@@ -204,6 +214,9 @@ int cpuidle_of_cooling_register(struct device_node *np,
goto out_unregister;
}
pr_debug("%s: Idle injection set with idle duration=%u, latency=%u\n",
dev_name, idle_duration_us, latency_us);
return 0;
out_unregister:
@@ -221,12 +234,38 @@ out:
* @drv: a cpuidle driver structure pointer
*
* This function is in charge of creating a cooling device per cpuidle
* driver and register it to thermal framework.
* driver and register it to the thermal framework.
*
* Return: zero on success, or negative value corresponding to the
* error detected in the underlying subsystems.
*/
int cpuidle_cooling_register(struct cpuidle_driver *drv)
void cpuidle_cooling_register(struct cpuidle_driver *drv)
{
return cpuidle_of_cooling_register(NULL, drv);
struct device_node *cooling_node;
struct device_node *cpu_node;
int cpu, ret;
for_each_cpu(cpu, drv->cpumask) {
cpu_node = of_cpu_device_node_get(cpu);
cooling_node = of_get_child_by_name(cpu_node, "thermal-idle");
of_node_put(cpu_node);
if (!cooling_node) {
pr_debug("'thermal-idle' node not found for cpu%d\n", cpu);
continue;
}
ret = __cpuidle_cooling_register(cooling_node, drv);
of_node_put(cooling_node);
if (ret) {
pr_err("Failed to register the cpuidle cooling device" \
"for cpu%d: %d\n", cpu, ret);
break;
}
}
}
drivers/thermal/devfreq_cooling.c
+23 -47
View File
@@ -24,11 +24,13 @@
#include <linux/idr.h>
#include <linux/slab.h>
#include <linux/pm_opp.h>
#include <linux/pm_qos.h>
#include <linux/thermal.h>
#include <trace/events/thermal.h>
#define SCALE_ERROR_MITIGATION 100
#define HZ_PER_KHZ 1000
#define SCALE_ERROR_MITIGATION 100
static DEFINE_IDA(devfreq_ida);
@@ -54,6 +56,8 @@ static DEFINE_IDA(devfreq_ida);
* The 'res_util' range is from 100 to (power_table[state] * 100)
* for the corresponding 'state'.
* @capped_state: index to cooling state with in dynamic power budget
* @req_max_freq: PM QoS request for limiting the maximum frequency
* of the devfreq device.
*/
struct devfreq_cooling_device {
int id;
@@ -66,49 +70,9 @@ struct devfreq_cooling_device {
struct devfreq_cooling_power *power_ops;
u32 res_util;
int capped_state;
struct dev_pm_qos_request req_max_freq;
};
/**
* partition_enable_opps() - disable all opps above a given state
* @dfc: Pointer to devfreq we are operating on
* @cdev_state: cooling device state we're setting
*
* Go through the OPPs of the device, enabling all OPPs until
* @cdev_state and disabling those frequencies above it.
*/
static int partition_enable_opps(struct devfreq_cooling_device *dfc,
unsigned long cdev_state)
{
int i;
struct device *dev = dfc->devfreq->dev.parent;
for (i = 0; i < dfc->freq_table_size; i++) {
struct dev_pm_opp *opp;
int ret = 0;
unsigned int freq = dfc->freq_table[i];
bool want_enable = i >= cdev_state ? true : false;
opp = dev_pm_opp_find_freq_exact(dev, freq, !want_enable);
if (PTR_ERR(opp) == -ERANGE)
continue;
else if (IS_ERR(opp))
return PTR_ERR(opp);
dev_pm_opp_put(opp);
if (want_enable)
ret = dev_pm_opp_enable(dev, freq);
else
ret = dev_pm_opp_disable(dev, freq);
if (ret)
return ret;
}
return 0;
}
static int devfreq_cooling_get_max_state(struct thermal_cooling_device *cdev,
unsigned long *state)
{
@@ -135,7 +99,7 @@ static int devfreq_cooling_set_cur_state(struct thermal_cooling_device *cdev,
struct devfreq_cooling_device *dfc = cdev->devdata;
struct devfreq *df = dfc->devfreq;
struct device *dev = df->dev.parent;
int ret;
unsigned long freq;
if (state == dfc->cooling_state)
return 0;
@@ -145,9 +109,10 @@ static int devfreq_cooling_set_cur_state(struct thermal_cooling_device *cdev,
if (state >= dfc->freq_table_size)
return -EINVAL;
ret = partition_enable_opps(dfc, state);
if (ret)
return ret;
freq = dfc->freq_table[state];
dev_pm_qos_update_request(&dfc->req_max_freq,
DIV_ROUND_UP(freq, HZ_PER_KHZ));
dfc->cooling_state = state;
@@ -530,9 +495,15 @@ of_devfreq_cooling_register_power(struct device_node *np, struct devfreq *df,
if (err)
goto free_dfc;
err = ida_simple_get(&devfreq_ida, 0, 0, GFP_KERNEL);
err = dev_pm_qos_add_request(df->dev.parent, &dfc->req_max_freq,
DEV_PM_QOS_MAX_FREQUENCY,
PM_QOS_MAX_FREQUENCY_DEFAULT_VALUE);
if (err < 0)
goto free_tables;
err = ida_simple_get(&devfreq_ida, 0, 0, GFP_KERNEL);
if (err < 0)
goto remove_qos_req;
dfc->id = err;
snprintf(dev_name, sizeof(dev_name), "thermal-devfreq-%d", dfc->id);
@@ -553,6 +524,10 @@ of_devfreq_cooling_register_power(struct device_node *np, struct devfreq *df,
release_ida:
ida_simple_remove(&devfreq_ida, dfc->id);
remove_qos_req:
dev_pm_qos_remove_request(&dfc->req_max_freq);
free_tables:
kfree(dfc->power_table);
kfree(dfc->freq_table);
@@ -601,6 +576,7 @@ void devfreq_cooling_unregister(struct thermal_cooling_device *cdev)
thermal_cooling_device_unregister(dfc->cdev);
ida_simple_remove(&devfreq_ida, dfc->id);
dev_pm_qos_remove_request(&dfc->req_max_freq);
kfree(dfc->power_table);
kfree(dfc->freq_table);
drivers/thermal/fair_share.c → drivers/thermal/gov_fair_share.c
View File
drivers/thermal/power_allocator.c → drivers/thermal/gov_power_allocator.c
View File
drivers/thermal/step_wise.c → drivers/thermal/gov_step_wise.c
View File
drivers/thermal/user_space.c → drivers/thermal/gov_user_space.c
+1 -1
View File
@@ -10,8 +10,8 @@
* ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
*/
#include <linux/thermal.h>
#include <linux/slab.h>
#include <linux/thermal.h>
#include "thermal_core.h"
drivers/thermal/imx8mm_thermal.c
+1 -1
View File
@@ -54,7 +54,7 @@ struct imx8mm_tmu {
void __iomem *base;
struct clk *clk;
const struct thermal_soc_data *socdata;
struct tmu_sensor sensors[0];
struct tmu_sensor sensors[];
};
static int imx8mm_tmu_get_temp(void *data, int *temp)

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