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mtd: spinand: add support for HeYangTek HYF1GQ4UDACAE
The HeYangTek HYF1GQ4UDACAE is a 1 Gbit (128 MiB) SLC SPI-NAND with 2048 + 64 byte pages and on-die 4-bit / 512-byte ECC; its JEDEC manufacturer ID is 0xc9. The die is GD5F1GQ4-compatible, so the OOB layout is taken from the in-tree gd5fxgq4xa. The die exposes only a coarse 2-bit ECC status with no fine-grained bitflip-count register, so the status is decoded into a representative number of corrected bitflips. It is found, among others, on some Keenetic KN-3411 (Buddy 6) units. Datasheet: https://www.heyangtek.cn/previewfile.jsp?file=ABUIABA9GAAgwsvRnwYo-eDpsgc Signed-off-by: Aleksei Sviridkin <f@lex.la> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
This commit is contained in:
committed by
Miquel Raynal
parent
dc59e4fea9
commit
a837468386
@@ -1,5 +1,5 @@
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# SPDX-License-Identifier: GPL-2.0
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spinand-objs := core.o otp.o
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spinand-objs += alliancememory.o ato.o dosilicon.o esmt.o fmsh.o foresee.o gigadevice.o
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spinand-objs += alliancememory.o ato.o dosilicon.o esmt.o fmsh.o foresee.o gigadevice.o heyangtek.o
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spinand-objs += macronix.o micron.o paragon.o skyhigh.o toshiba.o winbond.o xtx.o
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obj-$(CONFIG_MTD_SPI_NAND) += spinand.o
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@@ -1359,6 +1359,7 @@ static const struct spinand_manufacturer *spinand_manufacturers[] = {
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&fmsh_spinand_manufacturer,
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&foresee_spinand_manufacturer,
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&gigadevice_spinand_manufacturer,
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&heyangtek_spinand_manufacturer,
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¯onix_spinand_manufacturer,
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µn_spinand_manufacturer,
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¶gon_spinand_manufacturer,
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@@ -0,0 +1,132 @@
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// SPDX-License-Identifier: GPL-2.0
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/*
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* Authors:
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* Andrey Zolotarev <andrey.zolotarev@keenetic.com> - the main driver logic
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* Aleksei Sviridkin <f@lex.la> - adaptation to the mainline Linux kernel
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*
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* Based on:
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* https://github.com/keenetic/kernel-49/commit/bacade569fb12bc0ad31ba09bca9b890118fbca7
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*/
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#include <linux/device.h>
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#include <linux/kernel.h>
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#include <linux/mtd/spinand.h>
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#define SPINAND_MFR_HEYANGTEK 0xc9
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#define HYF1GQ4_STATUS_ECC_LIMIT_BITFLIPS (3 << 4)
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static SPINAND_OP_VARIANTS(read_cache_variants,
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SPINAND_PAGE_READ_FROM_CACHE_1S_4S_4S_OP(0, 1, NULL, 0, 0),
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SPINAND_PAGE_READ_FROM_CACHE_1S_1S_4S_OP(0, 1, NULL, 0, 0),
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SPINAND_PAGE_READ_FROM_CACHE_1S_2S_2S_OP(0, 1, NULL, 0, 0),
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SPINAND_PAGE_READ_FROM_CACHE_1S_1S_2S_OP(0, 1, NULL, 0, 0),
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SPINAND_PAGE_READ_FROM_CACHE_FAST_1S_1S_1S_OP(0, 1, NULL, 0, 0),
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SPINAND_PAGE_READ_FROM_CACHE_1S_1S_1S_OP(0, 1, NULL, 0, 0));
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static SPINAND_OP_VARIANTS(write_cache_variants,
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SPINAND_PROG_LOAD_1S_1S_4S_OP(true, 0, NULL, 0),
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SPINAND_PROG_LOAD_1S_1S_1S_OP(true, 0, NULL, 0));
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static SPINAND_OP_VARIANTS(update_cache_variants,
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SPINAND_PROG_LOAD_1S_1S_4S_OP(false, 0, NULL, 0),
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SPINAND_PROG_LOAD_1S_1S_1S_OP(false, 0, NULL, 0));
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/*
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* HYF1GQ4UDACAE is a GD5F1GQ4-compatible die, so the OOB layout is taken
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* from gd5fxgq4xa: the on-die ECC parity occupies bytes 8..15 of each
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* 16-byte section, the bad block marker sits in byte 0 and the remaining
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* bytes are exposed as free.
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*/
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static int hyf1gq4_ooblayout_ecc(struct mtd_info *mtd, int section,
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struct mtd_oob_region *region)
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{
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if (section > 3)
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return -ERANGE;
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region->offset = (16 * section) + 8;
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region->length = 8;
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return 0;
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}
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static int hyf1gq4_ooblayout_free(struct mtd_info *mtd, int section,
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struct mtd_oob_region *region)
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{
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if (section > 3)
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return -ERANGE;
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if (section) {
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region->offset = 16 * section;
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region->length = 8;
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} else {
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/* section 0 has one byte reserved for the bad block marker */
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region->offset = 1;
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region->length = 7;
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}
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return 0;
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}
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static const struct mtd_ooblayout_ops hyf1gq4_ooblayout = {
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.ecc = hyf1gq4_ooblayout_ecc,
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.free = hyf1gq4_ooblayout_free,
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};
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static int hyf1gq4_ecc_get_status(struct spinand_device *spinand, u8 status)
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{
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struct nand_device *nand = spinand_to_nand(spinand);
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switch (status & STATUS_ECC_MASK) {
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case STATUS_ECC_NO_BITFLIPS:
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return 0;
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case STATUS_ECC_UNCOR_ERROR:
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return -EBADMSG;
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case STATUS_ECC_HAS_BITFLIPS:
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/*
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* The die exposes only a coarse 2-bit ECC status and has no
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* register for the exact bitflip count. This code means
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* "corrected, below the refresh threshold", so report half of
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* the ECC strength as a representative value.
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*/
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return nanddev_get_ecc_conf(nand)->strength / 2;
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case HYF1GQ4_STATUS_ECC_LIMIT_BITFLIPS:
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/*
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* "Corrected, refresh recommended": report the full ECC
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* strength so the upper layers relocate the data.
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*/
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return nanddev_get_ecc_conf(nand)->strength;
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default:
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break;
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}
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return -EINVAL;
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}
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static const struct spinand_info heyangtek_spinand_table[] = {
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SPINAND_INFO("HYF1GQ4UDACAE",
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SPINAND_ID(SPINAND_READID_METHOD_OPCODE_ADDR, 0x21),
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NAND_MEMORG(1, 2048, 64, 64, 1024, 20, 1, 1, 1),
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NAND_ECCREQ(4, 512),
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SPINAND_INFO_OP_VARIANTS(&read_cache_variants,
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&write_cache_variants,
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&update_cache_variants),
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SPINAND_HAS_QE_BIT,
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SPINAND_ECCINFO(&hyf1gq4_ooblayout,
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hyf1gq4_ecc_get_status)),
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};
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static const struct spinand_manufacturer_ops heyangtek_spinand_manuf_ops = {
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};
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const struct spinand_manufacturer heyangtek_spinand_manufacturer = {
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.id = SPINAND_MFR_HEYANGTEK,
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.name = "HeYangTek",
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.chips = heyangtek_spinand_table,
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.nchips = ARRAY_SIZE(heyangtek_spinand_table),
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.ops = &heyangtek_spinand_manuf_ops,
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};
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@@ -437,6 +437,7 @@ extern const struct spinand_manufacturer esmt_c8_spinand_manufacturer;
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extern const struct spinand_manufacturer fmsh_spinand_manufacturer;
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extern const struct spinand_manufacturer foresee_spinand_manufacturer;
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extern const struct spinand_manufacturer gigadevice_spinand_manufacturer;
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extern const struct spinand_manufacturer heyangtek_spinand_manufacturer;
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extern const struct spinand_manufacturer macronix_spinand_manufacturer;
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extern const struct spinand_manufacturer micron_spinand_manufacturer;
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extern const struct spinand_manufacturer paragon_spinand_manufacturer;
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