Commit Graph

361773 Commits

Author SHA1 Message Date
Zhang Rui eea2d4812d Merge branch 'thermal_core-doc-comments-update' of .git into next 2013-04-25 00:57:22 +08:00
Eduardo Valentin a00e55f9c8 thermal: update kernel-doc for thermal_zone_device_register
This patch updates the documentation for thermal_zone_device_register
and removes the warnings generated by scripts/kernel-doc -v.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:56:39 +08:00
Eduardo Valentin 269c174f27 thermal: update kernel-doc for create_trip_attrs
This patch updates the documentation for create_trip_attrs
and removes the warnings generated by scripts/kernel-doc -v.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:56:35 +08:00
Eduardo Valentin 3a6eccb352 thermal: update kernel-doc for thermal_cooling_device_register
This patch updates the documentation for thermal_cooling_device_register
and removes the warnings generated by scripts/kernel-doc -v.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:56:32 +08:00
Eduardo Valentin 9892e5dc56 thermal: update kernel-doc for thermal_zone_unbind_cooling_device
This patch updates the documentation for thermal_zone_unbind_cooling_device
and removes the warnings generated by scripts/kernel-doc -v.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:56:28 +08:00
Eduardo Valentin d2e4eb83e7 thermal: update kernel-doc for thermal_zone_bind_cooling_device
This patch updates the documentation for thermal_zone_bind_cooling_device
and removes the warnings generated by scripts/kernel-doc -v.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:56:24 +08:00
Eduardo Valentin 910cb1e34d thermal: use EXPORT_SYMBOL_GPL
Restrict usage of GPL modules.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:56:19 +08:00
Eduardo Valentin 7b73c99377 thermal: rename notify_thermal_framework to thermal_notify_framework
To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:56:16 +08:00
Eduardo Valentin 6d8d4974a2 thermal: update driver license
As per the comment at the top of this file, this is a GPLv2 driver.
This patch updates the driver license accordingly.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:56:12 +08:00
Eduardo Valentin c7a8b9d916 thermal: use strlcpy instead of strcpy
For memory boundaries safety, use strlcpy instead of strcpy.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:56:07 +08:00
Zhang Rui a502be1873 Merge branch 'exynos-fix' of .git into next 2013-04-25 00:04:06 +08:00
Sachin Kamat b6cee53c19 Thermal: exynos: Add compatible string for exynos4412
Added compatible string for Exynos4412 SoC.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24 23:37:34 +08:00
Sachin Kamat 2a16279c68 Thermal: exynos: Add clk_{un}prepare APIs
clk_{un}prepare APIs are required to migrate to common
clock framework. While at it convert to use devm_clk_get as
it removes some cleanup code.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24 23:37:19 +08:00
Zhang Rui 335553ce40 Merge branch 'eduardo-1' of .git into next 2013-04-24 21:43:00 +08:00
Dan Carpenter 4f89038f17 Thermal: cpufreq cooling: endian bug in cpufreq_get_max_state()
This code doesn't work on big endian systems because we're storing low
values in the high bits of the unsigned long.  It makes it a very high
value instead.

Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-17 23:43:31 +08:00
Eduardo Valentin 837b26bb2e thermal: expose thermal_zone_get_temp API
This patch exports the thermal_zone_get_temp API so that driver
writers can fetch temperature of thermal zones managed by other
drivers.

Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15 09:39:02 +08:00
Eduardo Valentin 63c4d919cf thermal: introduce thermal_zone_get_zone_by_name helper function
This patch adds a helper function to get a reference of
a thermal zone, based on the zone type name.

It will perform a zone name lookup and return a reference
to a thermal zone device that matches the name requested.
In case the zone is not found or when several zones match
same name or if the required parameters are invalid, it will return
the corresponding error code (ERR_PTR).

Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15 09:34:28 +08:00
Zhang Rui d13cb03aef Merge branch 'thermal' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into next
Conflicts:
	drivers/thermal/cpu_cooling.c
2013-04-15 09:26:58 +08:00
Zhang Rui bbf7fc88c7 Thermal: build cpu_cooling code into thermal_sys module
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 23:28:49 +08:00
Zhang Rui 80a26a5c22 Thermal: build thermal governors into thermal_sys module
The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 23:28:43 +08:00
Zhang Rui 5fc024ab47 Thermal: rename thermal_sys.c to thermal_core.c
this is the preparation work to build all the thermal core framework
source file, like governors, cpu cooling, etc, into one module.

No functional change in this patch.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 02:14:12 +08:00
Arnd Bergmann 841d481b3c Thermal: exynos: remove unnecessary header inclusions
In multiplatform configurations, we cannot include headers
provided by only the exynos platform. Fortunately a number
of drivers that include those headers do not actually need
them, so we can just remove the inclusions.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Cc: linux-pm@vger.kernel.org
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-12 07:24:19 +08:00
Andrew Bresticker e79fe642cc thermal: step_wise: set throttle target within thermal instance limits
When selecting a target cooling state in get_target_state(), make sure
that the state is at least as high as the minimum when the temperature
is rising and at least as low as the maximum when the temperature is
falling.  This is necessary because, in the THREAML_TREND_RAISING and
THERMAL_TREND_DROPPING cases, the current state may only be incremented
or decremented by one even if it is outside the bounds of the thermal
instance.  This might occur, for example, if the CPU is heating up
and hits a thermal trip point for the first time when it's frequency
is much higher than the range specified by the thermal instance
corresponding to the trip point.

Signed-off-by: Andrew Bresticker <abrestic@chromium.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-12 07:23:50 +08:00
Eduardo Valentin 8837295a73 thermal: add a warning for temperature emulation feature
Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:34:42 +08:00
Amit Daniel Kachhap bffd1f8ac8 thermal: exynos: Adapt to temperature emulation core thermal framework
This removes the driver specific sysfs support of the temperature
emulation and uses the newly added core thermal framework for thermal
emulation. An exynos platform specific handler is added to support this.

In this patch, the exynos senor(tmu) related code and exynos framework
related (thermal zone, cooling devices) code are intentionally kept separate.
So an emulated function pointer is passed from sensor to framework. This is
beneficial in adding more sensor support using the same framework code
which is an ongoing work. The goal is to finally split them totally. Even
the existing read_temperature also follows the same execution method.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:29:54 +08:00