The external memory controller found on Tegra210 can use throttling of
the EMC frequency in order to reduce the memory chip temperature. Mark
the memory controller as a cooling device to take advantage of this
functionality.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Document the bindings for the memory controller found on Tegra210 SoCs.
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Pull SoC devicetree updates from Arnd Bergmann:
"There are a handful of new SoCs this time, all of these are more or
less related to chips in a wider family:
- SpacemiT Key Stone K3 is an 8-core risc-v chip, and the first
widely available RVA23 implementation. Note that this is entirely
unrelated with the similarly named Texas Instruments K3 chip family
that follwed the TI Keystone2 SoC.
- The Realtek Kent family of SoCs contains three chip models
rtd1501s, rtd1861b and rtd1920s, and is related to their earlier
Set-top-box and NAS products such as rtd1619, but is built on newer
Arm Cortex-A78 cores.
- The Qualcomm Milos family includes the Snapdragon 7s Gen 3 (SM7635)
mobile phone SoC built around Armv9 Kryo cores of the Arm
Cortex-A720 generation. This one is used in the Fairphone Gen 6
- Qualcomm Kaanapali is a new SoC based around eight high performance
Oryon CPU cores
- NXP i.MX8QP and i.MX952 are both feature reduced versions of chips
we already support, i.e. the i.MX8QM and i.MX952, with fewer CPU
cores and I/O interfaces.
As part of a cleanup, a number of SoC specific devicetree files got
removed because they did not have a single board using the .dtsi files
and they were never compile tested as a result: Samsung s3c6400, ST
spear320s, ST stm32mp21xc/stm32mp23xc/stm32mp25xc, Renesas
r8a779m0/r8a779m2/r8a779m4/r8a779m6/r8a779m7/r8a779m8/r8a779mb/
r9a07g044c1/r9a07g044l1/r9a07g054l1/r9a09g047e37, and TI
am3703/am3715. All of these could be restored easily if a new board
gets merged.
Broadcom/Cavium/Marvell ThunderX2 gets removed along with its only
machine, as all remaining users are assumed to be using ACPI based
firmware.
A relatively small number of 43 boards get added this time, and almost
all of them for arm64. Aside from the reference boards for the newly
added SoCs, this includes:
- Three server boards use 32-bit ASpeed BMCs
- One more reference board for 32-bit Microchip LAN9668
- 64-bit Arm single-board computers based on Amlogic s905y4, CIX
sky1, NXP ls1028a/imx8mn/imx8mp/imx91/imx93/imx95, Qualcomm
qcs6490/qrb2210 and Rockchip rk3568/rk3588s
- Carrier board for SOMs using Intel agilex5, Marvell Armada 7020,
NXP iMX8QP, Mediatek mt8370/mt8390 and rockchip rk3588
- Two mobile phones using Snapdragon 845
- A gaming device and a NAS box, both based on Rockchips rk356x
On top of the newly added boards and SoCs, there is a lot of
background activity going into cleanups, in particular towards getting
a warning-free dtc build, and the usual work on adding support for
more hardware on the previously added machines"
* tag 'soc-dt-7.0' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (757 commits)
dt-bindings: intel: Add Agilex eMMC support
arm64: dts: socfpga: agilex: add emmc support
arm64: dts: intel: agilex5: Add simple-bus node on top of dma controller node
ARM: dts: socfpga: fix dtbs_check warning for fpga-region
ARM: dts: socfpga: add #address-cells and #size-cells for sram node
dt-bindings: altera: document syscon as fallback for sys-mgr
arm64: dts: altera: Use lowercase hex
dt-bindings: arm: altera: combine Intel's SoCFPGA into altera.yaml
arm64: dts: socfpga: agilex5: Add IOMMUS property for ethernet nodes
arm64: dts: socfpga: agilex5: add support for modular board
dt-bindings: intel: Add Agilex5 SoCFPGA modular board
arm64: dts: socfpga: agilex5: Add dma-coherent property
arm64: dts: realtek: Add Kent SoC and EVB device trees
dt-bindings: arm: realtek: Add Kent Soc family compatibles
ARM: dts: samsung: Drop s3c6400.dtsi
ARM: dts: nuvoton: Minor whitespace cleanup
MAINTAINERS: Add Falcon DB
arm64: dts: a7k: add COM Express boards
ARM: dts: microchip: Drop usb_a9g20-dab-mmx.dtsi
arm64: dts: rockchip: Fix rk3588 PCIe range mappings
...
Memory controller drivers for v6.20
1. Mediatek SMI: Fix old struct device reference leaks during error
paths and device unbinding.
2. Memory Devicetree bindings: refactor existing LPDDR bindings and add
bindings for DDR4 SDRAM. These will be used for example in
stm32mp257f-ev1 DTS.
* tag 'memory-controller-drv-6.20' of https://git.kernel.org/pub/scm/linux/kernel/git/krzk/linux-mem-ctrl:
dt-bindings: memory: SDRAM channel: standardise node name
dt-bindings: memory: add DDR4 channel compatible
dt-bindings: memory: factorise LPDDR channel binding into SDRAM channel
dt-bindings: memory: introduce DDR4
dt-bindings: memory: factorise LPDDR props into SDRAM props
memory: mtk-smi: clean up device link creation
memory: mtk-smi: fix device leak on larb probe
memory: mtk-smi: fix device leaks on common probe
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
dt-bindings: Changes for v6.20-rc1
This series updates various DT bindings for Tegra architecture,
primarily focusing on schema validation fixes and new feature
documentation for Tegra234 and Tegra264 SoCs. Key changes include
converting Tegra20 NAND bindings to YAML, and updating memory, DMA, and
IOMMU definitions for Tegra264 (introducing CMDQV and DBB clock
support). Additionally, it resolves legacy warnings for Tegra30/132
display and VI interfaces.
* tag 'tegra-for-6.20-dt-bindings-v2' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux:
dt-bindings: display: tegra: document Tegra30 VI and VIP
dt-bindings: display: tegra: document Tegra132 MIPI calibration device
dt-bindings: mtd: nvidia,tegra20-nand: convert to DT schema
dt-bindings: dma: Update ADMA bindings for tegra264
dt-bindings: iommu: Add NVIDIA Tegra CMDQV support
dt-bindings: memory: tegra: Document DBB clock for Tegra264
dt-bindings: tegra: pmc: Update aotag as an optional aperture
Accesses to external memory are routed through the data backbone (DBB)
on Tegra264. A separate clock feeds this path and needs to be enabled
whenever an IP block makes an access to external memory. The external
memory controller driver is the best place to control this clock since
it knows how many devices are actively accessing memory.
Document the presence of this clock on Tegra264 only.
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Introduce JEDEC compliant DDR bindings, that use new memory-props binding.
The DDR4 compatible can be made of explicit vendor names and part
numbers or be of the form "ddrX-YYYY,AAAA...-ZZ" when associated with an
SPD, where (according to JEDEC SPD4.1.2.L-6):
- YYYY is the manufacturer ID
- AAAA... is the part number
- ZZ is the revision ID
The former form is useful when the SDRAM vendor and part number are
known, for example, when memory is soldered on the board.
The latter form is useful when SDRAM nodes are created at runtime by
boot firmware that doesn't have access to static part number information.
Signed-off-by: Clément Le Goffic <clement.legoffic@foss.st.com>
Signed-off-by: Clément Le Goffic <legoffic.clement@gmail.com>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://patch.msgid.link/20251118-b4-ddr-bindings-v9-2-a033ac5144da@gmail.com
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
LPDDR and DDR bindings are SDRAM types and are likely to share the same
properties (at least for density, io-width and reg).
To avoid bindings duplication, factorise the properties.
The compatible description has been updated because the MR (Mode
registers) used to get manufacturer ID and revision ID are not present
in case of DDR.
Those information should be in a SPD (Serial Presence Detect) EEPROM in
case of DIMM module or are known in case of soldered memory chips as
they are in the datasheet of the memory chips.
Signed-off-by: Clément Le Goffic <clement.legoffic@foss.st.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Clément Le Goffic <legoffic.clement@gmail.com>
Link: https://patch.msgid.link/20251118-b4-ddr-bindings-v9-1-a033ac5144da@gmail.com
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Pull SoC driver updates from Arnd Bergmann:
"Lots of platform specific updates for Qualcomm SoCs, including a new
TEE subsystem driver for the Qualcomm QTEE firmware interface.
Added support for the Apple A11 SoC in drivers that are shared with
the M1/M2 series, among more updates for those.
Smaller platform specific driver updates for Renesas, ASpeed,
Broadcom, Nvidia, Mediatek, Amlogic, TI, Allwinner, and Freescale
SoCs.
Driver updates in the cache controller, memory controller and reset
controller subsystems.
SCMI firmware updates to add more features and improve robustness.
This includes support for having multiple SCMI providers in a single
system.
TEE subsystem support for protected DMA-bufs, allowing hardware to
access memory areas that managed by the kernel but remain inaccessible
from the CPU in EL1/EL0"
* tag 'soc-drivers-6.18' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (139 commits)
soc/fsl/qbman: Use for_each_online_cpu() instead of for_each_cpu()
soc: fsl: qe: Drop legacy-of-mm-gpiochip.h header from GPIO driver
soc: fsl: qe: Change GPIO driver to a proper platform driver
tee: fix register_shm_helper()
pmdomain: apple: Add "apple,t8103-pmgr-pwrstate"
dt-bindings: spmi: Add Apple A11 and T2 compatible
serial: qcom-geni: Load UART qup Firmware from linux side
spi: geni-qcom: Load spi qup Firmware from linux side
i2c: qcom-geni: Load i2c qup Firmware from linux side
soc: qcom: geni-se: Add support to load QUP SE Firmware via Linux subsystem
soc: qcom: geni-se: Cleanup register defines and update copyright
dt-bindings: qcom: se-common: Add QUP Peripheral-specific properties for I2C, SPI, and SERIAL bus
Documentation: tee: Add Qualcomm TEE driver
tee: qcom: enable TEE_IOC_SHM_ALLOC ioctl
tee: qcom: add primordial object
tee: add Qualcomm TEE driver
tee: increase TEE_MAX_ARG_SIZE to 4096
tee: add TEE_IOCTL_PARAM_ATTR_TYPE_OBJREF
tee: add TEE_IOCTL_PARAM_ATTR_TYPE_UBUF
tee: add close_context to TEE driver operation
...
Pull SoC dt updates from Arnd Bergmann:
"There are five sets of new SoCs that get added in existing families,
all of them being either upgrades or cut-down versions of the older
chips:
- Apple M2 Pro, M2 Max and M2 Ultra, used in the 2022/2023 generation
of high-end workstations and laptops from Apple. Linux has been
working on these for a while but stil requires patches.
- Axis Artpec8 is an Armv8 chip based on Samsung Exynos design,
unlike the earlier Armv7 Artpec6 from the same company that was
part of a separate family of chips.
- NXP i.MX91 is a cut-down version of i.MX93, using only a single
Cortex-A55 core.
- Qualcomm Lemans Auto is a variant of the Lemans SoC that was
originally merged under the sa8775p name, the differences being
mostly the firmware configuration of the platform.
- Four new Renesas SoCs RZ/T2H (r9a09g077m44), RZ/N2H (r9a09g087m44),
RZ/T2H (r9a09g077), and RZ/N2H (r9a09g087) are all industrial
bedded SoCs based on Cortex-A55 cores
In total, there are 65 new machines, including:
- Industrial embedded system and single-board computers based on NXP,
Allwinner, TI, Rockchips, Marvell, Xilinx Spacemit, Starfive chips.
- Reference boards for the newly added Renesas, Qualcomm, NXP and
Axis ARMv8 chips as well as Microchip's MPFS RISC-V SoC
- Laptops and Workstations using Apple M2 and Qualcomm Snapdragon X1
chips.
- Several Samsung phones using Qualcomm Snapdragon chips
- Set-top boxes based on Allwinner H313
- Five BMC boards using 32-bit ASpeed SoCs
- Three network routers using IXP4xx (ARMv5!) and Broadcom bcm4708
(ARMv7) SoCs
Two machines get phased out because they were available only in small
quantities but never made it into products: one STi407 based reference
board, and a Snapdragon 845 based Chromebook.
Aside from the newly added machines, a lot of work went into improving
hardware support on the existing machines and cleaning up contents for
validation"
* tag 'soc-dt-6.18' of git://git.kernel.org/pub/scm/linux/kernel/git/soc/soc: (931 commits)
arm64: dts: apm-shadowcat: Drop "apm,xgene2-pcie" compatible
arm64: dts: apm-shadowcat: Move slimpro nodes out of "simple-bus" node
ARM: dts: microchip: sam9x7: Add qspi controller
arm64: dts: qcom: Add MST pixel streams for displayport
arm64: dts: qcom: sm6350: correct DP compatibility strings
arm64: dts: qcom: monaco-evk: Enable Adreno 623 GPU
arm64: dts: qcom: qcs8300-ride: Enable Adreno 623 GPU
arm64: dts: qcom: qcs8300: Add gpu and gmu nodes
arm64: dts: allwinner: h313: Add Amediatech X96Q
dt-bindings: arm: sunxi: Add Amediatech X96Q
arm64: dts: apple: t8015: Add SPMI node
arm64: dts: apple: t8012: Add SPMI node
arm64: dts: apple: Add J180d (Mac Pro, M2 Ultra, 2023) device tree
arm64: dts: rockchip: Add devicetree for the ROC-RK3588-RT
dt-bindings: arm: rockchip: Add Firefly ROC-RK3588-RT
arm64: dts: rockchip: update pinctrl names for Radxa E52C
arm64: dts: rockchip: remove vcc_3v3_pmu regulator for Radxa E52C
arm64: dts: apple: Add J474s, J475c and J475d device trees
arm64: dts: apple: Add J414 and J416 Macbook Pro device trees
arm64: dts: apple: Add initial t6020/t6021/t6022 DTs
...
Memory controller drivers for v6.17
1. Several cleanups: Use dev_fwnode() in OMAP GPMX, convert
arm,pl172.txt DT bindings to DT schema, use
syscon_regmap_lookup_by_phandle_args() wrapper, correct kerneldoc.
2. Mediatek MT8186 SMI: Extend hardware bandwidth limits to fix VENC
hardware during stress testing.
3. Broadcom brcmstb_memc: Add additional fallback compatible and
simplify device driver matching. The change comes from Broadcom
SoC maintainer (Florian Fainelli), thus its ABI impact is
acknowledged.
* tag 'memory-controller-drv-6.17' of https://git.kernel.org/pub/scm/linux/kernel/git/krzk/linux-mem-ctrl:
dt-bindings: memory: renesas,rzg3e-xspi: Document RZ/V2H(P) and RZ/V2N support
memory: brcmstb_memc: Simplify compatible matching
dt-bindings: memory-controller: Define fallback compatible
memory: omap-gpmx: Use dev_fwnode()
memory: mtk-smi: Add ostd setting for mt8186
dt-bindings: memory-controllers: convert arm,pl172.txt to yaml format
memory: stm32_omm: Use syscon_regmap_lookup_by_phandle_args
memory: emif: Add missing kerneldoc for lpmode
Link: https://lore.kernel.org/r/20250715095315.59299-2-krzysztof.kozlowski@linaro.org
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Add bindings for the Memory Controller (MC) and External Memory
Controller (EMC) found on the Tegra264 SoC. Tegra264 SoC has a different
number of interrupt lines for MC sub-units: UCF_SOC, hub, hub common,
syncpoint and MC channel. The total number of interrupt lines is eight.
Update maxItems for MC interrupts accordingly.
This also adds a header containing the memory client ID definitions that
are used by the interconnects property in DT and the tegra_mc_client
table in the MC driver. These IDs are defined by the hardware, so the
numbering doesn't start at 0 and contains holes. Also added are the
stream IDs for various hardware blocks found on Tegra264. These are
allocated as blocks of 256 IDs and each block can be subdivided for
additional fine-grained isolation if needed.
Signed-off-by: Sumit Gupta <sumitg@nvidia.com>
[treding@nvidia.com: add SMMU stream IDs, squash patches]
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20250709222147.3758356-2-thierry.reding@gmail.com
Signed-off-by: Thierry Reding <treding@nvidia.com>
Memory controller drivers for v6.16
1. Mediatek: Add support for MT6893 MTK SMI.
2. STM32: Add new driver for STM32 Octo Memory Manager (OMM), which
manages muxing between two OSPI busses.
3. Several cleanups and minor improvements (OMAP GPMC, Kconfig entries,
BT1 L2).
* tag 'memory-controller-drv-6.16' of https://git.kernel.org/pub/scm/linux/kernel/git/krzk/linux-mem-ctrl:
MAINTAINERS: add entry for STM32 OCTO MEMORY MANAGER driver
memory: Add STM32 Octo Memory Manager driver
dt-bindings: memory-controllers: Add STM32 Octo Memory Manager controller
bus: firewall: Fix missing static inline annotations for stubs
memory: bt1-l2-ctl: replace scnprintf() with sysfs_emit()
memory: mtk-smi: Add support for Dimensity 1200 MT6893 SMI
dt-bindings: memory: mtk-smi: Add support for MT6893
memory: tegra: Do not enable by default during compile testing
memory: Simplify 'default' choice in Kconfig
memory: omap-gpmc: remove GPIO set() and direction_output() callbacks
memory: omap-gpmc: use the dedicated define for GPIO direction
Link: https://lore.kernel.org/r/20250508093451.55755-2-krzysztof.kozlowski@linaro.org
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
