Pull thermal control fix from Rafael Wysocki:
"Add a new CPU ID to the list of supported processors in the
intel_tcc_cooling driver (Sumeet Pawnikar)"
* tag 'thermal-5.19-rc5' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel_tcc_cooling: Add TCC cooling support for RaptorLake
Add RaptorLake to the list of processor models supported by the Intel
TCC cooling driver.
Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
[ rjw: Subject edits, new changelog ]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Pull additional thermal control update from Rafael Wysocki:
"Add Meteor Lake PCI device ID to the int340x thermal control driver
(Sumeet Pawnikar)"
* tag 'thermal-5.19-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: int340x: Add Meteor Lake PCI device ID
Pull thermal control updates from Rafael Wysocki:
"These add a thermal library and thermal tools to wrap the netlink
interface into event-based callbacks, improve overheat condition
handling during suspend-to-idle on Intel SoCs, add some new hardware
support, fix bugs and clean up code.
Specifics:
- Add thermal library and thermal tools to encapsulate the netlink
into event based callbacks (Daniel Lezcano, Jiapeng Chong).
- Improve overheat condition handling during suspend-to-idle in the
Intel PCH thermal driver (Zhang Rui).
- Use local ops instead of global ops in devfreq_cooling (Kant Fan).
- Clean up _OSC handling in int340x (Davidlohr Bueso).
- Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
(Hesham Almatary).
- Add new k3 j72xx bangdap driver and the corresponding bindings
(Keerthy).
- Fix missing of_node_put() in the SC iMX driver at probe time
(Miaoqian Lin).
- Fix memory leak in __thermal_cooling_device_register()
when device_register() fails by calling
thermal_cooling_device_destroy_sysfs() (Yang Yingliang).
- Add sc8180x and sc8280xp compatible string in the DT bindings and
lMH support for QCom tsens driver (Bjorn Andersson).
- Fix OTP Calibration Register values conforming to the documentation
on RZ/G2L and bindings documentation for RZ/G2UL (Biju Das).
- Fix type in kerneldoc description for __thermal_bind_params
(Corentin Labbe).
- Fix potential NULL dereference in sr_thermal_probe() on Broadcom
platform (Zheng Yongjun).
- Add change mode ops to the thermal-of sensor (Manaf Meethalavalappu
Pallikunhi).
- Fix non-negative value support by preventing the value to be clamp
to zero (Stefan Wahren).
- Add compatible string and DT bindings for MSM8960 tsens driver
(Dmitry Baryshkov).
- Add hwmon support for K3 driver (Massimiliano Minella).
- Refactor and add multiple generations support for QCom ADC driver
(Jishnu Prakash).
- Use platform_get_irq_optional() to get the interrupt on RCar driver
and document Document RZ/V2L bindings (Lad Prabhakar).
- Remove NULL check after container_of() call from the Intel HFI
thermal driver (Haowen Bai)"
* tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (38 commits)
thermal: intel: pch: improve the cooling delay log
thermal: intel: pch: enhance overheat handling
thermal: intel: pch: move cooling delay to suspend_noirq phase
PM: wakeup: expose pm_wakeup_pending to modules
thermal: k3_j72xx_bandgap: Add the bandgap driver support
dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation
thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe
thermal/core: Fix memory leak in __thermal_cooling_device_register()
dt-bindings: thermal: tsens: Add sc8280xp compatible
dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible
thermal/drivers/qcom/lmh: Add sc8180x compatible
thermal/drivers/rz2gl: Fix OTP Calibration Register values
dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings
thermal: thermal_of: fix typo on __thermal_bind_params
tools/thermal: remove unneeded semicolon
tools/lib/thermal: remove unneeded semicolon
thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe
tools/thermal: Add thermal daemon skeleton
tools/thermal: Add a temperature capture tool
tools/thermal: Add util library
...
Pull power management updates from Rafael Wysocki:
"These add support for 'artificial' Energy Models in which power
numbers for different entities may be in different scales, add support
for some new hardware, fix bugs and clean up code in multiple places.
Specifics:
- Update the Energy Model support code to allow the Energy Model to
be artificial, which means that the power values may not be on a
uniform scale with other devices providing power information, and
update the cpufreq_cooling and devfreq_cooling thermal drivers to
support artificial Energy Models (Lukasz Luba).
- Make DTPM check the Energy Model type (Lukasz Luba).
- Fix policy counter decrementation in cpufreq if Energy Model is in
use (Pierre Gondois).
- Add CPU-based scaling support to passive devfreq governor (Saravana
Kannan, Chanwoo Choi).
- Update the rk3399_dmc devfreq driver (Brian Norris).
- Export dev_pm_ops instead of suspend() and resume() in the IIO
chemical scd30 driver (Jonathan Cameron).
- Add namespace variants of EXPORT[_GPL]_SIMPLE_DEV_PM_OPS and
PM-runtime counterparts (Jonathan Cameron).
- Move symbol exports in the IIO chemical scd30 driver into the
IIO_SCD30 namespace (Jonathan Cameron).
- Avoid device PM-runtime usage count underflows (Rafael Wysocki).
- Allow dynamic debug to control printing of PM messages (David
Cohen).
- Fix some kernel-doc comments in hibernation code (Yang Li, Haowen
Bai).
- Preserve ACPI-table override during hibernation (Amadeusz
Sławiński).
- Improve support for suspend-to-RAM for PSCI OSI mode (Ulf Hansson).
- Make Intel RAPL power capping driver support the RaptorLake and
AlderLake N processors (Zhang Rui, Sumeet Pawnikar).
- Remove redundant store to value after multiply in the RAPL power
capping driver (Colin Ian King).
- Add AlderLake processor support to the intel_idle driver (Zhang
Rui).
- Fix regression leading to no genpd governor in the PSCI cpuidle
driver and fix the riscv-sbi cpuidle driver to allow a genpd
governor to be used (Ulf Hansson).
- Fix cpufreq governor clean up code to avoid using kfree() directly
to free kobject-based items (Kevin Hao).
- Prepare cpufreq for powerpc's asm/prom.h cleanup (Christophe
Leroy).
- Make intel_pstate notify frequency invariance code when no_turbo is
turned on and off (Chen Yu).
- Add Sapphire Rapids OOB mode support to intel_pstate (Srinivas
Pandruvada).
- Make cpufreq avoid unnecessary frequency updates due to mismatch
between hardware and the frequency table (Viresh Kumar).
- Make remove_cpu_dev_symlink() clear the real_cpus mask to simplify
code (Viresh Kumar).
- Rearrange cpufreq_offline() and cpufreq_remove_dev() to make the
calling convention for some driver callbacks consistent (Rafael
Wysocki).
- Avoid accessing half-initialized cpufreq policies from the show()
and store() sysfs functions (Schspa Shi).
- Rearrange cpufreq_offline() to make the calling convention for some
driver callbacks consistent (Schspa Shi).
- Update CPPC handling in cpufreq (Pierre Gondois).
- Extend dev_pm_domain_detach() doc (Krzysztof Kozlowski).
- Move genpd's time-accounting to ktime_get_mono_fast_ns() (Ulf
Hansson).
- Improve the way genpd deals with its governors (Ulf Hansson).
- Update the turbostat utility to version 2022.04.16 (Len Brown, Dan
Merillat, Sumeet Pawnikar, Zephaniah E. Loss-Cutler-Hull, Chen Yu)"
* tag 'pm-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (94 commits)
PM: domains: Trust domain-idle-states from DT to be correct by genpd
PM: domains: Measure power-on/off latencies in genpd based on a governor
PM: domains: Allocate governor data dynamically based on a genpd governor
PM: domains: Clean up some code in pm_genpd_init() and genpd_remove()
PM: domains: Fix initialization of genpd's next_wakeup
PM: domains: Fixup QoS latency measurements for IRQ safe devices in genpd
PM: domains: Measure suspend/resume latencies in genpd based on governor
PM: domains: Move the next_wakeup variable into the struct gpd_timing_data
PM: domains: Allocate gpd_timing_data dynamically based on governor
PM: domains: Skip another warning in irq_safe_dev_in_sleep_domain()
PM: domains: Rename irq_safe_dev_in_no_sleep_domain() in genpd
PM: domains: Don't check PM_QOS_FLAG_NO_POWER_OFF in genpd
PM: domains: Drop redundant code for genpd always-on governor
PM: domains: Add GENPD_FLAG_RPM_ALWAYS_ON for the always-on governor
powercap: intel_rapl: remove redundant store to value after multiply
cpufreq: CPPC: Enable dvfs_possible_from_any_cpu
cpufreq: CPPC: Enable fast_switch
ACPI: CPPC: Assume no transition latency if no PCCT
ACPI: bus: Set CPPC _OSC bits for all and when CPPC_LIB is supported
ACPI: CPPC: Check _OSC for flexible address space
...
Pull hwmon updates from Guenter Roeck:
"New drivers:
- Driver for the Microchip LAN966x SoC
- PMBus driver for Infineon Digital Multi-phase xdp152 family
controllers
Chip support added to existing drivers:
- asus-ec-sensors:
- Support for ROG STRIX X570-E GAMING WIFI II, PRIME X470-PRO, and
ProArt X570 Creator WIFI
- External temperature sensor support for ASUS WS X570-ACE
- nct6775:
- Support for I2C driver
- Support for ASUS PRO H410T / PRIME H410M-R /
ROG X570-E GAMING WIFI II
- lm75:
- Support for - Atmel AT30TS74
- pmbus/max16601:
- Support for MAX16602
- aquacomputer_d5next:
- Support for Aquacomputer Farbwerk
- Support for Aquacomputer Octo
- jc42:
- Support for S-34TS04A
Kernel API changes / clarifications:
- The chip parameter of with_info API is now mandatory
- New hwmon_device_register_for_thermal API call for use by the
thermal subsystem
Improvements:
- PMBus and JC42 drivers now register with thermal subsystem
- PMBus drivers now support get_voltage/set_voltage power operations
- The adt7475 driver now supports pin configuration
- The lm90 driver now supports setting extended range temperatures
configuration with a devicetree property
- The dell-smm driver now registers as cooling device
- The OCC driver delays hwmon registration until requested by
userspace
... and various other minor fixes and improvements"
* tag 'hwmon-for-v5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/groeck/linux-staging: (71 commits)
hwmon: (aquacomputer_d5next) Fix an error handling path in aqc_probe()
hwmon: (sl28cpld) Fix typo in comment
hwmon: (pmbus) Check PEC support before reading other registers
hwmon: (dimmtemp) Fix bitmap handling
hwmon: (lm90) enable extended range according to DTS node
dt-bindings: hwmon: lm90: add ti,extended-range-enable property
dt-bindings: hwmon: lm90: add missing ti,tmp461
hwmon: (ibmaem) Directly use ida_alloc()/free()
hwmon: Directly use ida_alloc()/free()
hwmon: (asus-ec-sensors) fix Formula VIII definition
dt-bindings: trivial-devices: Add xdp152
hwmon: (sl28cpld-hwmon) Use HWMON_CHANNEL_INFO macro
hwmon: (pwm-fan) Use HWMON_CHANNEL_INFO macro
hwmon: (peci/dimmtemp) Use HWMON_CHANNEL_INFO macro
hwmon: (peci/cputemp) Use HWMON_CHANNEL_INFO macro
hwmon: (mr75203) Use HWMON_CHANNEL_INFO macro
hwmon: (ltc2992) Use HWMON_CHANNEL_INFO macro
hwmon: (as370-hwmon) Use HWMON_CHANNEL_INFO macro
hwmon: Make chip parameter for with_info API mandatory
thermal/drivers/thermal_hwmon: Use hwmon_device_register_for_thermal()
...
Marge Energy Model support updates and cpuidle updates for 5.19-rc1:
- Update the Energy Model support code to allow the Energy Model to be
artificial, which means that the power values may not be on a uniform
scale with other devices providing power information, and update the
cpufreq_cooling and devfreq_cooling thermal drivers to support
artificial Energy Models (Lukasz Luba).
- Make DTPM check the Energy Model type (Lukasz Luba).
- Fix policy counter decrementation in cpufreq if Energy Model is in
use (Pierre Gondois).
- Add AlderLake processor support to the intel_idle driver (Zhang Rui).
- Fix regression leading to no genpd governor in the PSCI cpuidle
driver and fix the riscv-sbi cpuidle driver to allow a genpd
governor to be used (Ulf Hansson).
* pm-em:
PM: EM: Decrement policy counter
powercap: DTPM: Check for Energy Model type
thermal: cooling: Check Energy Model type in cpufreq_cooling and devfreq_cooling
Documentation: EM: Add artificial EM registration description
PM: EM: Remove old debugfs files and print all 'flags'
PM: EM: Change the order of arguments in the .active_power() callback
PM: EM: Use the new .get_cost() callback while registering EM
PM: EM: Add artificial EM flag
PM: EM: Add .get_cost() callback
* pm-cpuidle:
cpuidle: riscv-sbi: Fix code to allow a genpd governor to be used
cpuidle: psci: Fix regression leading to no genpd governor
intel_idle: Add AlderLake support
The thermal subsystem registers a hwmon device without providing chip
information or sysfs attribute groups. While undesirable, it would be
difficult to change. On the other side, it abuses the
hwmon_device_register_with_info API by not providing that information.
Use new API specifically created for the thermal subsystem instead to
let us enforce the 'chip' parameter for other callers of
hwmon_device_register_with_info().
Acked-by: Rafael J . Wysocki <rafael@kernel.org>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Previously, during suspend, intel_pch_thermal driver logs for every
cooling iteration, about the current PCH temperature and number of cooling
iterations that have been tried, like below
[ 100.955526] intel_pch_thermal 0000:00:14.2: CPU-PCH current temp [53C] higher than the threshold temp [50C], sleep 1 times for 100 ms duration
[ 101.064156] intel_pch_thermal 0000:00:14.2: CPU-PCH current temp [53C] higher than the threshold temp [50C], sleep 2 times for 100 ms duration
After changing the default delay_cnt to 600, in practice, it is common to
see tens of the above messages if the system is suspended when PCH
overheats. Thus, change this log message from dev_warn to dev_dbg because
it is only useful when we want to check the temperature trend.
At the same time, there is always a one-line message given by the driver
with the patch applied, with below four possibilities.
1. PCH is cool, no cooling delay needed
[ 1791.902853] intel_pch_thermal 0000:00:12.0: CPU-PCH is cool [48C]
2. PCH overheats and becomes cool after the cooling delays
[ 1475.511617] intel_pch_thermal 0000:00:12.0: CPU-PCH is cool [49C] after 30700 ms delay
3. PCH still overheats after the overall cooling timeout
[ 2250.157487] intel_pch_thermal 0000:00:12.0: CPU-PCH is hot [60C] after 60000 ms delay. S0ix might fail
4. PCH aborts cooling because of wakeup event detected during the delay
[ 1933.639509] intel_pch_thermal 0000:00:12.0: Wakeup event detected, abort cooling
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Commit ef63b043ac ("thermal: intel: pch: fix S0ix failure due to PCH
temperature above threshold") introduces delay loop mechanism that allows
PCH temperature to go down below threshold during suspend so it won't
block S0ix. And the default overall delay timeout is 1 second.
However, in practice, we found that the time it takes to cool the PCH down
below threshold highly depends on the initial PCH temperature when the
delay starts, as well as the ambient temperature.
And in some cases, the 1 second delay is not sufficient. As a result, the
system stays in a shallower power state like PCx instead of S0ix, and
drains the battery power, without user' notice.
To make sure S0ix is not blocked by the PCH overheating, we
1. expand the default overall timeout to 60 seconds.
2. make sure the temperature is below threshold rather than equal to it.
At the same time, as the cooling delay can be much longer and many wakeup
events (ACPI Power Button press, USB mouse move, etc) becomes valid in the
suspend_noirq phase, add detection of wakeup event so that the driver
does not delay blindly when the system suspend is likely to abort soon.
This patch may introduce longer suspend time, but only in the cases when
the system overheats and Linux used to enter a shallower S2idle state,
say, PCx instead of S0ix.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 J72XX supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455
The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production,
with the resulting values stored in software-readable registers. Software
should use these register values when translating the Temperature
Monitor output codes to temperature values.
It has an involved workaround. Software needs to read the error codes for
-40C, 30C, 125C from the efuse for each device & derive a new look up table
for adc to temperature conversion. Involved calculating slopes & constants
using 3 different straight line equations with adc refernce codes as the
y-axis & error codes in the x-axis.
-40C to 30C
30C to 125C
125C to 150C
With the above 2 line equations we derive the full look-up table to
workaround the errata i2128 for j721e SoC.
Tested temperature reading on J721e SoC & J7200 SoC.
[daniel.lezcano@linaro.org: Generate look-up tables run-time]
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
