This patch does a cleanup about the thermal zone govenor,
setting and make the following rule.
1. For thermal zone devices that are registered w/o tz->tzp,
they can use the default thermal governor only.
2. For thermal zone devices w/ governor name specified in
tz->tzp->governor_name, we will use the default govenor
if the governor specified is not available at the moment,
and update tz->governor when the matched governor is registered.
This also fixes a problem that OF registered thermal zones
are running with no governor.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Javi Merino <javi.merino@arm.com>
In initialization, if the cooling device is initialized at
max cooling state, and the thermal zone temperature is below
the first trip point, then the cooling state can't be updated
to the right state, untill the first trip point be triggered.
To fix this issue, allow first update of cooling device state
during registration, initialized "updated" device field as
"false" (instead of "true").
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST)
broke build on archs wihout io memory.
On archs like S390 or um this driver cannot build nor work.
Make it depend on HAS_IOMEM to bypass build failures.
drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource'
drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource'
Signed-off-by: Richard Weinberger <richard@nod.at>
Acked-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The thermal zone type should not include an instance number. Otherwise
each zone is considered a different type and the thermal-to-hwmon
bridge fails to group them all in a single hwmon device.
I also changed the type to "x86_pkg_temp", because "pkg" was too
generic, and other thermal drivers use an underscore, not a dash, as
a separator. Or maybe "cpu_pkg_temp" would be better?
Signed-off-by: Jean Delvare <jdelvare@suse.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The temperature value reported by x86_pkg_temp_thermal is already
reported by the coretemp driver. So, do not expose this thermal zone
as a hwmon device, because it would be redundant.
Signed-off-by: Jean Delvare <jdelvare@suse.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
"This time, the biggest change is the work of representing hardware
thermal properties in device tree infrastructure.
This work includes the introduction of a device tree bindings for
describing the hardware thermal behavior and limits, and also a parser
to read and interpret the data, and build thermal zones and thermal
binding parameters. It also contains three examples on how to use the
new representation on sensor devices, using three different drivers to
accomplish it. One driver is in thermal subsystem, the TI SoC
thermal, and the other two drivers are in hwmon subsystem.
Actually, this would be the first step of the complete work because we
still need to check other potential drivers to be converted and then
validate the proposed API. But the reason why I include it in this
pull request is that, first, this change does not hurt any others
without using this approach, second, the principle and concept of this
change would not break after converting the remaining drivers. BTW,
as you can see, there are several points in this change that do not
belong to thermal subsystem. Because it has been suggested by Guenter
R that in such cases, it is recommended to send the complete series
via one single subsystem.
Specifics:
- representing hardware thermal properties in device tree
infrastructure
- fix a regression that the imx thermal driver breaks system suspend.
- introduce ACPI INT3403 thermal driver to retrieve temperature data
from the INT3403 ACPI device object present on some systems.
- introduce debug statement for thermal core and step_wise governor.
- assorted fixes and cleanups for thermal core, cpu cooling, exynos
thrmal, intel powerclamp and imx thermal driver"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
thermal: remove const flag from .ops of imx thermal
Thermal: update thermal zone device after setting emul_temp
intel_powerclamp: Fix cstate counter detection.
thermal: imx: add necessary clk operation
Thermal cpu cooling: return error if no valid cpu frequency entry
thermal: fix cpu_cooling max_level behavior
thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST
thermal: debug: add debug statement for core and step_wise
thermal: imx_thermal: add module device table
drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c
thermal:samsung: fix compilation warning
thermal: imx: correct suspend/resume flow
thermal: exynos: fix error return code
Thermal: ACPI INT3403 thermal driver
MAINTAINERS: add thermal bindings entry in thermal domain
arm: dts: make OMAP4460 bandgap node to belong to OCP
arm: dts: make OMAP443x bandgap node to belong to OCP
arm: dts: add cooling properties on omap5 cpu node
arm: dts: add omap5 thermal data
arm: dts: add omap5 CORE thermal data
...
Pull ACPI and power management updates from Rafael Wysocki:
"As far as the number of commits goes, the top spot belongs to ACPI
this time with cpufreq in the second position and a handful of PM
core, PNP and cpuidle updates. They are fixes and cleanups mostly, as
usual, with a couple of new features in the mix.
The most visible change is probably that we will create struct
acpi_device objects (visible in sysfs) for all devices represented in
the ACPI tables regardless of their status and there will be a new
sysfs attribute under those objects allowing user space to check that
status via _STA.
Consequently, ACPI device eject or generally hot-removal will not
delete those objects, unless the table containing the corresponding
namespace nodes is unloaded, which is extremely rare. Also ACPI
container hotplug will be handled quite a bit differently and cpufreq
will support CPU boost ("turbo") generically and not only in the
acpi-cpufreq driver.
Specifics:
- ACPI core changes to make it create a struct acpi_device object for
every device represented in the ACPI tables during all namespace
scans regardless of the current status of that device. In
accordance with this, ACPI hotplug operations will not delete those
objects, unless the underlying ACPI tables go away.
- On top of the above, new sysfs attribute for ACPI device objects
allowing user space to check device status by triggering the
execution of _STA for its ACPI object. From Srinivas Pandruvada.
- ACPI core hotplug changes reducing code duplication, integrating
the PCI root hotplug with the core and reworking container hotplug.
- ACPI core simplifications making it use ACPI_COMPANION() in the
code "glueing" ACPI device objects to "physical" devices.
- ACPICA update to upstream version 20131218. This adds support for
the DBG2 and PCCT tables to ACPICA, fixes some bugs and improves
debug facilities. From Bob Moore, Lv Zheng and Betty Dall.
- Init code change to carry out the early ACPI initialization
earlier. That should allow us to use ACPI during the timekeeping
initialization and possibly to simplify the EFI initialization too.
From Chun-Yi Lee.
- Clenups of the inclusions of ACPI headers in many places all over
from Lv Zheng and Rashika Kheria (work in progress).
- New helper for ACPI _DSM execution and rework of the code in
drivers that uses _DSM to execute it via the new helper. From
Jiang Liu.
- New Win8 OSI blacklist entries from Takashi Iwai.
- Assorted ACPI fixes and cleanups from Al Stone, Emil Goode, Hanjun
Guo, Lan Tianyu, Masanari Iida, Oliver Neukum, Prarit Bhargava,
Rashika Kheria, Tang Chen, Zhang Rui.
- intel_pstate driver updates, including proper Baytrail support,
from Dirk Brandewie and intel_pstate documentation from Ramkumar
Ramachandra.
- Generic CPU boost ("turbo") support for cpufreq from Lukasz
Majewski.
- powernow-k6 cpufreq driver fixes from Mikulas Patocka.
- cpufreq core fixes and cleanups from Viresh Kumar, Jane Li, Mark
Brown.
- Assorted cpufreq drivers fixes and cleanups from Anson Huang, John
Tobias, Paul Bolle, Paul Walmsley, Sachin Kamat, Shawn Guo, Viresh
Kumar.
- cpuidle cleanups from Bartlomiej Zolnierkiewicz.
- Support for hibernation APM events from Bin Shi.
- Hibernation fix to avoid bringing up nonboot CPUs with ACPI EC
disabled during thaw transitions from Bjørn Mork.
- PM core fixes and cleanups from Ben Dooks, Leonardo Potenza, Ulf
Hansson.
- PNP subsystem fixes and cleanups from Dmitry Torokhov, Levente
Kurusa, Rashika Kheria.
- New tool for profiling system suspend from Todd E Brandt and a
cpupower tool cleanup from One Thousand Gnomes"
* tag 'pm+acpi-3.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (153 commits)
thermal: exynos: boost: Automatic enable/disable of BOOST feature (at Exynos4412)
cpufreq: exynos4x12: Change L0 driver data to CPUFREQ_BOOST_FREQ
Documentation: cpufreq / boost: Update BOOST documentation
cpufreq: exynos: Extend Exynos cpufreq driver to support boost
cpufreq / boost: Kconfig: Support for software-managed BOOST
acpi-cpufreq: Adjust the code to use the common boost attribute
cpufreq: Add boost frequency support in core
intel_pstate: Add trace point to report internal state.
cpufreq: introduce cpufreq_generic_get() routine
ARM: SA1100: Create dummy clk_get_rate() to avoid build failures
cpufreq: stats: create sysfs entries when cpufreq_stats is a module
cpufreq: stats: free table and remove sysfs entry in a single routine
cpufreq: stats: remove hotplug notifiers
cpufreq: stats: handle cpufreq_unregister_driver() and suspend/resume properly
cpufreq: speedstep: remove unused speedstep_get_state
platform: introduce OF style 'modalias' support for platform bus
PM / tools: new tool for suspend/resume performance optimization
ACPI: fix module autoloading for ACPI enumerated devices
ACPI: add module autoloading support for ACPI enumerated devices
ACPI: fix create_modalias() return value handling
...
Pull trivial tree updates from Jiri Kosina:
"Usual rocket science stuff from trivial.git"
* 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial: (39 commits)
neighbour.h: fix comment
sched: Fix warning on make htmldocs caused by wait.h
slab: struct kmem_cache is protected by slab_mutex
doc: Fix typo in USB Gadget Documentation
of/Kconfig: Spelling s/one/once/
mkregtable: Fix sscanf handling
lp5523, lp8501: comment improvements
thermal: rcar: comment spelling
treewide: fix comments and printk msgs
IXP4xx: remove '1 &&' from a condition check in ixp4xx_restart()
Documentation: update /proc/uptime field description
Documentation: Fix size parameter for snprintf
arm: fix comment header and macro name
asm-generic: uaccess: Spelling s/a ny/any/
mtd: onenand: fix comment header
doc: driver-model/platform.txt: fix a typo
drivers: fix typo in DEVTMPFS_MOUNT Kconfig help text
doc: Fix typo (acces_process_vm -> access_process_vm)
treewide: Fix typos in printk
drivers/gpu/drm/qxl/Kconfig: reformat the help text
...
This patch provides auto disable/enable operation for boost. It uses already
present thermal infrastructure to provide BOOST hysteresis.
The TMU data is modified to work properly with or without BOOST.
Hence, the two first trip points with corresponding clip frequencies are
adjusted.
The first one is reduced from 85 to 70 degrees and the clip frequency is
increased to 1.4 GHz from 800 MHz. This trip point is in fact responsible
for providing BOOST hysteresis. When temperature exceeds 70 deg, the maximal
non BOOST frequency for Exynos4412 is imposed.
Since the first trigger level has been "stolen" for BOOST, the second one
needs to be a compromise for the previously used two for non BOOST
configuration. The 95 deg with modified clip freq (to 400 MHz) should provide
a good balance between cooling down the overheated device and throughput on
an acceptable level.
Two last trigger levels are not modified since, they cause platform shutdown
on emergency overheat to happen.
The third trip point passage results in SW managed shut down of the system.
If the last trip point is crossed, the PMU HW generates the power off
signal.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Myungjoo Ham <myungjoo.ham@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
[rjw: Changelog]
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
This patch is to update thermal zone device after setting emul_temp
in order to make governor work according to input temperature immediately.
Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Having all zero cstate count doesn't necesserily mean the cstate
counter is no functional.
Signed-off-by: Yuxuan Shui <yshuiv7@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Thermal sensor needs pll3_usb_otg when measuring temperature,
otherwise the temperature read will be incorrect, so need to
enable this clk before sensor working, for alarm function,
as hardware will take measurement periodically, so we should
keep this clk always on once alarm function is enabled.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
As per Documentation/thermal/sysfs-api.txt, max_level
is an index, not a counter. Thus, in case a CPU has
3 valid frequencies, max_level is expected to be 2, for instance.
The current code makes max_level == number of valid frequencies,
which is bogus. This patch fix the cpu_cooling device by
ranging max_level properly.
Reported-by: Carlos Hernandez <ceh@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Mark function sys_set_trip_temp() as static in x86_pkg_temp_thermal.c
because it is not used outside this file.
This eliminates the following warning in x86_pkg_temp_thermal.c:
drivers/thermal/x86_pkg_temp_thermal.c:218:5: warning: no previous prototype for ‘sys_set_trip_temp’ [-Wmissing-prototypes]
Signed-off-by: Rashika Kheria <rashika.kheria@gmail.com>
Reviewed-by: Josh Triplett <josh@joshtriplett.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
