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Linus Torvalds
42daabf62b
Pull ARM SoC late changes from Arnd Bergmann:
"These are changes that arrived a little late before the merge window
or that have multiple dependencies on previous branches so they did
not fit into one of the earlier ones. There are 10 branches merged
here, a total of 39 non-merge commits. Contents are a mixed bag for
the above reasons:
* Two new SoC platforms: ST microelectronics stixxxx and the TI
'Nspire' graphing calculator. These should have been in the 'soc'
branch but were a little late
* Support for the Exynos 5420 variant in mach-exynos, which is based
on the other exynos branches to avoid conflicts.
* Various small changes for sh-mobile, ux500 and davinci
* Common clk support for MSM"
* tag 'late-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (39 commits)
ARM: ux500: bail out on alien cpus
ARM: davinci: da850: adopt to pinctrl-single change for configuring multiple pins
serial: sh-sci: Initialise variables before access in sci_set_termios()
ARM: stih41x: Add B2020 board support
ARM: stih41x: Add B2000 board support
ARM: sti: Add DEBUG_LL console support
ARM: sti: Add STiH416 SOC support
ARM: sti: Add STiH415 SOC support
ARM: msm: Migrate to common clock framework
ARM: msm: Make proc_comm clock control into a platform driver
ARM: msm: Prepare clk_get() users in mach-msm for clock-pcom driver
ARM: msm: Remove clock-7x30.h include file
ARM: msm: Remove custom clk_set_{max,min}_rate() API
ARM: msm: Remove custom clk_set_flags() API
msm: iommu: Use clk_set_rate() instead of clk_set_min_rate()
msm: iommu: Convert to clk_prepare/unprepare
msm_sdcc: Convert to clk_prepare/unprepare
usb: otg: msm: Convert to clk_prepare/unprepare
msm_serial: Use devm_clk_get() and properly return errors
msm_serial: Convert to clk_prepare/unprepare
...
69 lines
2.0 KiB
Plaintext
69 lines
2.0 KiB
Plaintext
Device tree binding vendor prefix registry. Keep list in alphabetical order.
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This isn't an exhaustive list, but you should add new prefixes to it before
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using them to avoid name-space collisions.
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ad Avionic Design GmbH
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adi Analog Devices, Inc.
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aeroflexgaisler Aeroflex Gaisler AB
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ak Asahi Kasei Corp.
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amcc Applied Micro Circuits Corporation (APM, formally AMCC)
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apm Applied Micro Circuits Corporation (APM)
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arm ARM Ltd.
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atmel Atmel Corporation
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bosch Bosch Sensortec GmbH
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brcm Broadcom Corporation
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cavium Cavium, Inc.
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chrp Common Hardware Reference Platform
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cirrus Cirrus Logic, Inc.
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cortina Cortina Systems, Inc.
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dallas Maxim Integrated Products (formerly Dallas Semiconductor)
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denx Denx Software Engineering
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emmicro EM Microelectronic
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epson Seiko Epson Corp.
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est ESTeem Wireless Modems
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fsl Freescale Semiconductor
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GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
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gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
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hp Hewlett Packard
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ibm International Business Machines (IBM)
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idt Integrated Device Technologies, Inc.
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img Imagination Technologies Ltd.
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intercontrol Inter Control Group
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linux Linux-specific binding
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lsi LSI Corp. (LSI Logic)
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marvell Marvell Technology Group Ltd.
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maxim Maxim Integrated Products
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mosaixtech Mosaix Technologies, Inc.
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national National Semiconductor
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nintendo Nintendo
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nvidia NVIDIA
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nxp NXP Semiconductors
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onnn ON Semiconductor Corp.
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picochip Picochip Ltd
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powervr PowerVR (deprecated, use img)
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qcom Qualcomm, Inc.
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ralink Mediatek/Ralink Technology Corp.
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ramtron Ramtron International
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realtek Realtek Semiconductor Corp.
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renesas Renesas Electronics Corporation
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samsung Samsung Semiconductor
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sbs Smart Battery System
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schindler Schindler
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sil Silicon Image
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silabs Silicon Laboratories
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simtek
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sirf SiRF Technology, Inc.
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snps Synopsys, Inc.
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st STMicroelectronics
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ste ST-Ericsson
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stericsson ST-Ericsson
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ti Texas Instruments
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toshiba Toshiba Corporation
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v3 V3 Semiconductor
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via VIA Technologies, Inc.
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wlf Wolfson Microelectronics
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wm Wondermedia Technologies, Inc.
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winbond Winbond Electronics corp.
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xlnx Xilinx
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