This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.
This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.
This way, the messages will always be bound to a thermal zone.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
These two new thermal_trend types are used to tell the governor
that the temeprature is raising/dropping quickly.
Thermal cooling governors should handle this situation and make
proper decisions, e.g. set cooling state to upper/lower limit directly
instead of one step each time.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds a notification API which the sensor drivers'
can use to notify the framework. The framework then takes
care of the throttling according to the configured policy.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch makes the thermal_cdev_update function as a
global one, so that other files can use it. This function
serves as a single arbitrator to set the state of a cooling
device.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch creates a structure to hold platform
thermal governor information, and provides APIs
for individual thermal governors to register/unregister
with the Thermal framework.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds platform level information to thermal.h
by introducing two structures to hold:
* bind parameters for a thermal zone,
* zone level platform parameters
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
* get_tz_trend: obtain the trend of the given thermal zone
* get_thermal_instance: obtain the instance corresponding
to the given tz, cdev and the trip point.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch rearranges the code in thermal.h file,
in the following order, so that it is easy to
read/maintain.
1. All #defines
2. All enums
3. All fops structures
4. All device structures
5. All function declarations
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.
But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.
With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
of all its instances.
Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances
thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.
So We introduce .get_trend() as a more general solution.
For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
set upper and lower limits when binding
a thermal cooling device to a thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
Pull battery updates from Anton Vorontsov:
"The tag contains just a few battery-related changes for v3.6. It's is
all pretty straightforward, except one thing.
One of our patches added thermal support for power supply class, but
thermal/ subsystem changed under our feet. We (well, Stephen, that
is) caught the issue and it was decided[1] that I'd just delay the
battery pull request, and then will fix it up by merging upstream back
into battery tree at the specific commit.
That's not all though: another[2] small fixup for thermal subsystem
was needed to get rid of a warning in power supply subsystem (the
warning was not drivers/power's "fault", the thermal registration
function just needed a proper const annotation, which is also done by
a small commit on top of the merge.
So, to sum this up:
- The 'master' branch of the battery tree was in the -next tree for
weeks, was never rebased, altered etc. It should be all OK;
- Although, for-v3.6 tag contains the 'master' branch + merge + the
warning fix.
[1] http://lkml.org/lkml/2012/6/19/23
[2] http://lkml.org/lkml/2012/6/18/28"
* tag 'for-v3.6' of git://git.infradead.org/battery-2.6: (23 commits)
thermal: Constify 'type' argument for the registration routine
olpc-battery: update CHARGE_FULL_DESIGN property for BYD LiFe batteries
olpc-battery: Add VOLTAGE_MAX_DESIGN property
charger-manager: Fix build break related to EXTCON
lp8727_charger: Move header file into platform_data directory
power_supply: Add min/max alert properties for CAPACITY, TEMP, TEMP_AMBIENT
bq27x00_battery: Add support for BQ27425 chip
charger-manager: Set current limit of regulator for over current protection
charger-manager: Use EXTCON Subsystem to detect charger cables for charging
test_power: Add VOLTAGE_NOW and BATTERY_TEMP properties
test_power: Add support for USB AC source
gpio-charger: Use cansleep version of gpio_set_value
bq27x00_battery: Add support for power average and health properties
sbs-battery: Don't trigger false supply_changed event
twl4030_charger: Allow charger to control the regulator that feeds it
twl4030_charger: Add backup-battery charging
twl4030_charger: Fix some typos
max17042_battery: Support CHARGE_COUNTER power supply attribute
smb347-charger: Add constant charge and current properties
power_supply: Add constant charge_current and charge_voltage properties
...
thermal_zone_device_register() does not modify 'type' argument, so it is
safe to declare it as const. Otherwise, if we pass a const string, we are
getting the ugly warning:
CC drivers/power/power_supply_core.o
drivers/power/power_supply_core.c: In function 'psy_register_thermal':
drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default]
include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *'
Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.
This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Acked-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
THERMAL_HWMON is implemented inside the thermal_sys driver and has no
effect on drivers implementing thermal zones, so they shouldn't see
anything related to it in <linux/thermal.h>. Making the THERMAL_HWMON
implementation fully internal has two advantages beyond the cleaner
design:
* This avoids rebuilding all thermal drivers if the THERMAL_HWMON
implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or
disabled.
* This avoids breaking the thermal kABI in these cases too, which should
make distributions happy.
The only drawback I can see is slightly higher memory fragmentation, as
the number of kzalloc() calls will increase by one per thermal zone. But
I doubt it will be a problem in practice, as I've never seen a system with
more than two thermal zones.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
Amit Daniel Kachhap
Eduardo Valentin
Zhang Rui
Durgadoss R
Linus Torvalds
Anton Vorontsov
Durgadoss R
Jean Delvare